Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Current - Supply | Supplier Device Package | RoHS Status | Other Names | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
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NXP USA Inc. FH32K144UIT0VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FH32K144UIT0VLHRTR | 1,500 | |||||||||||||||||||||||
NXP USA Inc. SPC5746CHK1ACKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 MPC57xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP (24x24) | ROHS3 Compliant | 568-SPC5746CHK1ACKU6 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SAI, SPI | DMA, I²S, LVD/HVD, POR, WDT | 3MB (3M x 8) | FLASH | 128K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 68x10b, 31x12b SAR | Internal | ||||||
NXP USA Inc. MC35FS6516CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | Automotive, System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | - | 48-HLQFP (7x7) | ROHS3 Compliant | 568-MC35FS6516CAE | 250 | |||||||||||||||||
NXP USA Inc. MC33FS6526NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive, System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | - | 48-HLQFP (7x7) | ROHS3 Compliant | 568-MC33FS6526NAER2TR | 2,000 |
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