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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Current - Supply | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Standards | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Interface | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC33981ADHFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-PowerQFN | Slew Rate Controlled, Status Flag, Watchdog Timer | MC33981 | Non-Inverting | N-Channel | 1:1 | 16-PQFN (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 168 | Not Required | On/Off, PWM | 1 | Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO | High Side | 6mOhm (Max) | 4.5V ~ 27V | Relay, Solenoid Driver | 40A | ||||||||||||||||||||||||
| NXP USA Inc. MFS8631BMBA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8631 | - | 4.5V ~ 36V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8630BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8630 | - | 4.5V ~ 36V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8623BMBA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8623 | - | 4.5V ~ 36V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8601BMBA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8601 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8610BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8610 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. MIMXRT595SFFOCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX | Tape & Reel (TR) | Active | -20°C ~ 70°C (TA) | Surface Mount | 249-WFBGA | MIMXRT595 | 249-FOWLP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 2,000 | 136 | ARM® Cortex®-M33 | 32-Bit Dual-Core | 200MHz | eMMC/SD/SDIO, I²C, LINbus, SPI, UART/USART, USB | DMA, I²S, LCD, POR, PWM, WDT | 192KB (192K x 8) | ROM | - | 5M x 8 | 1.71V ~ 3.6V | A/D 10x12b | External, Internal | |||||||||||||||||||||||||
| NXP USA Inc. MFS8601BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8601 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8603BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8603 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8613BMBA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8613 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8600BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8600 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MIMXRT555SFAWCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX | Tape & Reel (TR) | Active | -20°C ~ 70°C (TA) | Surface Mount | 141-XFBGA, WLCSP | MIMXRT555 | 141-WLCSP (4.53x4.53) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 6,000 | 136 | ARM® Cortex®-M33 | 32-Bit Dual-Core | 200MHz | eMMC/SD/SDIO, I²C, LINbus, SPI, UART/USART, USB | DMA, I²S, LCD, POR, PWM, WDT | 192KB (192K x 8) | ROM | - | 5M x 8 | 1.71V ~ 3.6V | A/D 10x12b | External, Internal | |||||||||||||||||||||||||
| NXP USA Inc. MFS8611BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8611 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MIMXRT533SFFOC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX | Tray | Active | -20°C ~ 70°C (TA) | Surface Mount | 249-WFBGA | MIMXRT533 | 249-FOWLP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 260 | 136 | ARM® Cortex®-M33 | 32-Bit Dual-Core | 200MHz | eMMC/SD/SDIO, I²C, LINbus, SPI, UART/USART, USB | DMA, I²S, LCD, POR, PWM, WDT | 192KB (192K x 8) | ROM | - | 3M x 8 | 1.71V ~ 3.6V | A/D 10x12b | External, Internal | |||||||||||||||||||||||||
| NXP USA Inc. MFS8613BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8613 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8611BMBA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8611 | - | 4.5V ~ 60V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8621BMDA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8621 | - | 4.5V ~ 36V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MFS8621BMBA0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Camera | Surface Mount | 48-VFQFN Exposed Pad | MFS8621 | - | 4.5V ~ 36V | 48-QFN (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. SC18IS606PWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | 16-TSSOP (0.173", 4.40mm Width) | 4mA | 1.71V ~ 3.6V | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | Controller | - | I²C | SPI | ||||||||||||||||||||||||||||||||
| NXP USA Inc. SC18IS604PWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | 16-TSSOP (0.173", 4.40mm Width) | 4mA | 1.71V ~ 3.6V | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | Controller | - | I²C | SPI | ||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5534JHI48/00K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | LPC5534 | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,300 | 32 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | |||||||||||||||||||||||
| NXP USA Inc. LPC5536JBD100K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC5536 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 66 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 23x16b; D/A 2x12b | Internal | |||||||||||||||||||||||
| NXP USA Inc. LPC5534JBD100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC5534 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 23x16b; D/A 2x12b | Internal | |||||||||||||||||||||||
| NXP USA Inc. LPC5536JHI48/00K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | LPC5536 | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,300 | 32 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | |||||||||||||||||||||||
| NXP USA Inc. LPC5534JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5534 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 39 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | Internal | |||||||||||||||||||||||
| NXP USA Inc. LPC5536JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5536 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 39 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | Internal | |||||||||||||||||||||||
| NXP USA Inc. LPC5536JHI48/00E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | LPC5536 | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 32 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | |||||||||||||||||||||||
| NXP USA Inc. MKE17Z128VLF7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MKE17Z128 | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 1,250 | 42 | ARM® Cortex®-M0+ | 32-Bit | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MKE17Z256VLF7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MKE17Z256 | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 1,250 | 42 | ARM® Cortex®-M0+ | 32-Bit | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1062XVN5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 225-LFBGA | MIMXRT1062 | 225-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MIMXRT1062XVN5B | 5A992C | 8542.31.0001 | 160 | 149 | ARM® Cortex®-M7 | 32-Bit | 500MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 128KB (128K x 8) | ROM | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | Internal |
