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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Voltage - Rated | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Frequency | Technology | Voltage - Input | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Data Rate | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Voltage - Output | Current Rating (Amps) | Current - Test | Power - Output | Gain | Noise Figure | Voltage - Test |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MKL05Z32VLF4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL0 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MKL05Z32 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317844557 | 3A991A2 | 8542.31.0001 | 250 | 41 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 14x12b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1823JBD144E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | LPC1823 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935299788551 | 3A991A2 | 8542.31.0001 | 60 | 83 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 104K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1823JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC1823 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 49 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 104K x 8 | 2.2V ~ 3.6V | A/D 4x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1825JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC1825 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 49 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, WDT | 768KB (768K x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 4x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1827JBD144E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | LPC1827 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935299791551 | 3A991A2 | 8542.31.0001 | 60 | 83 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1827JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC1827 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 49 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, WDT | 1MB (1M x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 4x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1837JBD144E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | LPC1837 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 83 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1837JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC18xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC1837 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 49 | ARM® Cortex®-M3 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, WDT | 1MB (1M x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 4x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC4322JBD144E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | LPC4322 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 83 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 104K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC4323JBD144E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | LPC4323 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 83 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 104K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC4327JBD144E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | LPC4327 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 83 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC4333JBD144E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | LPC4333 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 83 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC4353JBD208E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-LQFP | LPC4353 | 208-LQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 36 | 142 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. AFT21S232SR5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | 65 V | Chassis Mount | NI-780S | AFT21 | 2.11GHz | LDMOS | NI-780S | ROHS3 Compliant | Not Applicable | REACH Unaffected | 5A991G | 8541.29.0095 | 50 | - | 1.5 A | 50W | 16.7dB | - | 28 V | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33663AJEFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | Transceiver | MC336 | 7V ~ 18V | 14-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314696518 | EAR99 | 8542.39.0001 | 2,500 | LINbus | 2/2 | - | - | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33663ALEFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | Transceiver | MC336 | 7V ~ 18V | 14-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310968518 | EAR99 | 8542.39.0001 | 2,500 | LINbus | 2/2 | - | - | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK10DN128VLH5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK10DN128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321733528 | 3A991A2 | 8542.31.0001 | 1,500 | 44 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 19x16b | Internal | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0100F0EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | 12 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XET256J2CAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323133528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08SC4E0CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319585534 | 3A991A2 | 8542.31.0001 | 5,000 | 12 | S08 | 8-Bit | 40MHz | LINbus, SCI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F84540VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC56F84 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321721557 | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EX | 32-Bit Single-Core | 80MHz | CANbus, I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 8K x 8 | 3V ~ 3.6V | A/D 10x12b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6D4AVT08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325679557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6D4AVT10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319909557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S1AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319989557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S4AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323322557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S6AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317659557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U4AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323386557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U6AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311343557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U7CVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312063557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK10DN512VMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK10DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314793557 | 3A991A2 | 8542.31.0001 | 348 | 90 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal |
