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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Voltage - Input | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Voltage - Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MCIMX6Q6AVT08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. MCIMX6S1AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. MCIMX6S4AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||
| NXP USA Inc. MCIMX6S5DVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320221557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||
| NXP USA Inc. MCIMX6S5EVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311756557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||
| NXP USA Inc. MCIMX6S6AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311372557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||
| NXP USA Inc. MK20DX256VLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK20DX256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311568557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK52DN512CMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | MK52DN512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. MK63FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK63FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||||||||||||||||||||
| NXP USA Inc. MK64FN1M0VDC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK64FN1M0 | 121-XFBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318682557 | 3A991A2 | 8542.31.0001 | 348 | 83 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 37x16b; D/A 2x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK64FN1M0VLL12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK64FN1M0 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315207557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 32x16b; D/A 1x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK64FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK64FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324728557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK64FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK64FN1M0 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315206557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MK64FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK64FX512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324731557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 192K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||
| NXP USA Inc. MKE02Z32VLC2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z32 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315854557 | 3A991A2 | 8542.31.0001 | 250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||
| NXP USA Inc. MKE02Z32VQH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE02Z32 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 84 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||
| NXP USA Inc. MKE02Z64VLH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE02Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||
| NXP USA Inc. MKE04Z8VWJ4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MKE04Z8 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317919574 | 3A991A2 | 8542.31.0001 | 38 | 18 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b; D/A 2x6b | Internal | |||||||||||||||||||
| NXP USA Inc. MKM14Z64CHH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 44-VFLGA Exposed Pad | MKM14Z64 | 44-MAPLGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324716557 | 3A991A2 | 8542.31.0001 | 2,450 | 20 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 5x16b, 4x24b | Internal | |||||||||||||||||||
| NXP USA Inc. MMPF0100F0AEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317731557 | EAR99 | 8542.39.0001 | 260 | 12 | Multiple | ||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200NPAEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311454557 | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | ||||||||||||||||||||||||||||
| NXP USA Inc. P2010NSN2NHC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | 0°C ~ 125°C (TA) | Surface Mount | 689-BBGA Exposed Pad | P2010 | 689-TEPBGA II (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321966557 | 3A991A2 | 8542.31.0001 | 135 | PowerPC e500v2 | 1.2GHz | 1 Core, 32-Bit | - | DDR2, DDR3 | No | - | 10/100/1000Mbps (3) | - | USB 2.0 + PHY (2) | - | - | DUART, I²C, MMC/SD, SPI | |||||||||||||||||||
| NXP USA Inc. P2020NSE2NHC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | 0°C ~ 125°C (TA) | Surface Mount | 689-BBGA Exposed Pad | P2020 | 689-TEPBGA II (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325867557 | OBSOLETE | 0000.00.0000 | 27 | PowerPC e500v2 | 1.2GHz | 2 Core, 32-Bit | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000Mbps (3) | - | USB 2.0 + PHY (2) | - | Cryptography, Random Number Generator | DUART, I²C, MMC/SD, SPI | |||||||||||||||||||
 |
NXP USA Inc. P2040NXE7MMC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 780-BFBGA | P2040 | 780-FCPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320185557 | 5A002A1 FRE | 8542.31.0001 | 60 | PowerPC e500mc | 1.2GHz | 4 Core, 32-Bit | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000Mbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | DUART, I²C, MMC/SD, RapidIO, SPI | ||||||||||||||||||
| NXP USA Inc. P2041NSE7NNC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 780-BBGA, FCBGA | P2041 | 780-FCPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323481557 | 5A002A1 FRE | 8542.31.0001 | 60 | PowerPC e500mc | 1.3GHz | 4 Core, 32-Bit | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000Mbps (5), 10Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | DUART, I²C, MMC/SD, RapidIO, SPI | |||||||||||||||||||
|
NXP USA Inc. P2041NXN7NNC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 780-BFBGA | P2041 | 780-FCPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325809557 | 5A002A1 FRE | 8542.31.0001 | 60 | PowerPC e500mc | 1.3GHz | 4 Core, 32-Bit | - | DDR3, DDR3L | No | - | 10/100/1000Mbps (5), 10Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | - | DUART, I²C, MMC/SD, RapidIO, SPI | ||||||||||||||||||
| NXP USA Inc. P3041NXE7PNC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P3 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 1295-BBGA, FCBGA | P3041NXE7 | 1295-FCPBGA (37.5x37.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321985557 | 5A002A1 FRE | 8542.31.0001 | 21 | PowerPC e500mc | 1.5GHz | 4 Core, 32-Bit | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000Mbps (5), 10Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.5V, 1.8V, 2.5V, 3.3V | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | DUART, I²C, MMC/SD, RapidIO, SPI | |||||||||||||||||||
| NXP USA Inc. S9S08AW16AE0VFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | S9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318571557 | 3A991A2 | 8542.31.0001 | 1,300 | 38 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||
| NXP USA Inc. S9S08DZ16F2VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314798557 | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||||||||||||||||||
| NXP USA Inc. S9S12GN32F0CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323289557 | 3A991A2 | 8542.31.0001 | 1,300 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal |
