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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Type | Base Product Number | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Data Rate | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S9S12G64F0CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,250 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||
| NXP USA Inc. S9S12XS128J1CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319395557 | 3A991A2 | 8542.31.0001 | 800 | 44 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||||||||||||||||||
| NXP USA Inc. SPC5604PEF1MLL6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | SPC5604 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 68 | e200z0h | 32-Bit Single-Core | 64MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 64K x 8 | 40K x 8 | 3V ~ 5.5V | A/D 30x10b | Internal | ||||||||||||||||||||||
| NXP USA Inc. SPC5673FF3MVR3 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BBGA | SPC5673 | 416-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323239557 | 3A991A2 | 8542.31.0001 | 200 | 32 | e200z7 | 32-Bit Single-Core | 264MHz | CANbus, SCI, SPI | DMA, POR, PWM | 3MB (3M x 8) | FLASH | - | 192K x 8 | 1.08V ~ 5.25V | A/D 64x12b | External | |||||||||||||||||||||
| NXP USA Inc. MC33663ASEF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | Transceiver | MC336 | 7V ~ 18V | 14-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314697574 | EAR99 | 8542.39.0001 | 55 | LINbus | 2/2 | - | - | ||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S1AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319989557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||
| NXP USA Inc. MCIMX6S4AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323322557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||
| NXP USA Inc. MCIMX6S6AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317659557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||
| NXP USA Inc. MCIMX6U4AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323386557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||
| NXP USA Inc. MCIMX6U6AVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311343557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||
| NXP USA Inc. MCIMX6U7CVM08AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312063557 | 5A992C | 8542.31.0001 | 300 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||
| NXP USA Inc. MK10DN512VMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK10DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314793557 | 3A991A2 | 8542.31.0001 | 348 | 90 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK10DX128VLK7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK10DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314757557 | 3A991A2 | 8542.31.0001 | 96 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 1x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK11DX128VLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK11DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319974557 | 3A991A2 | 8542.31.0001 | 480 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 24x16b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK12DX128VLF5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MK12DX128 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321769557 | 3A991A2 | 8542.31.0001 | 250 | 33 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 18x16b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK12DX128VMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK12DX128 | 121-MAPBGA (8x8) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 60 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 24x16b; D/A 1x12b | Internal | ||||||||||||||||||||||
| NXP USA Inc. MK20DN512VMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK20DN512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317669557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK20DX128VLK7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK20DX128 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323284557 | 3A991A2 | 8542.31.0001 | 96 | 52 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK20DX64VLK7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK20DX64 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314758557 | 3A991A2 | 8542.31.0001 | 96 | 52 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 16K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK22DN512VMC5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK22DN512 | 121-MAPBGA (8x8) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 935325698557 | 3A991A2 | 8542.31.0001 | 348 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK22DX128VLF5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MK22DX128 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317697557 | 3A991A2 | 8542.31.0001 | 250 | 29 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 14x16b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK22DX256VLK5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK22DX256 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321792557 | 3A991A2 | 8542.31.0001 | 480 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK30DX256VLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K30 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK30DX256 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314794557 | 3A991A2 | 8542.31.0001 | 60 | 102 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LCD, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 46x16b; D/A 2x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK40DX128VMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K40 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK40DX128 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 98 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||||
| NXP USA Inc. MK51DN512CLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | MK51DN512 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319969557 | 3A991A2 | 8542.31.0001 | 60 | 94 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK51DX128CMC7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 121-LFBGA | MK51DX128 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 61 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 35x16b; D/A 1x12b | Internal | ||||||||||||||||||||||
| NXP USA Inc. MK52DN512CLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | MK52DN512 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319948557 | 3A991A2 | 8542.31.0001 | 60 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||||
| NXP USA Inc. MK53DN512CLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | MK53DN512 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 94 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||||||||||||||||||||||
| NXP USA Inc. MK60DN256VMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK60DN256 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||||
| NXP USA Inc. MKL04Z16VLC4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL0 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKL04Z16 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 14x12b | Internal |
