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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Voltage - Rated | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Frequency | Technology | Current - Supply | Voltage - Input | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Configuration | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Display Type | Digits or Characters | Rds On (Typ) | Voltage - Load | Voltage - Output | Switch Type | Current - Output (Max) | FET Type | Current Rating (Amps) | Current - Test | Power - Output | Gain | Drain to Source Voltage (Vdss) | Current - Continuous Drain (Id) @ 25°C | Drive Voltage (Max Rds On, Min Rds On) | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Gate Charge (Qg) (Max) @ Vgs | Vgs (Max) | Input Capacitance (Ciss) (Max) @ Vds | FET Feature | Power Dissipation (Max) | Noise Figure | Voltage - Test |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S912XET256J2CAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311832557 | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XET256J2CAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311832528 | 3A991A2 | 8542.31.0001 | 750 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XET256J2CALR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315505528 | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XET256J2MAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | S912 | 80-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315065528 | 3A991A2 | 8542.31.0001 | 750 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XET256J2MALR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317062528 | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XET256J2VAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315439557 | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 16K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DN32F2VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311119557 | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 1.5K x 8 | 2.7V ~ 5.5V | A/D 10x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DN48F2MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314796557 | 3A991A2 | 8542.31.0001 | 250 | 39 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DZ16F2MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323301557 | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DZ16F2MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314813557 | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DZ32F2MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DZ48F2CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324587557 | 3A991A2 | 8542.31.0001 | 800 | 53 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 3K x 8 | 2.7V ~ 5.5V | A/D 24x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DZ60F2CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321777557 | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DZ60F2CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314783557 | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08DZ60F2CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317674557 | 3A991A2 | 8542.31.0001 | 800 | 53 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 24x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PCF8545BTT/AJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 95°C | Surface Mount | 56-TFSOP (0.240", 6.10mm Width) | PCF8545 | 30 µA | 1.8V ~ 5.5V | 56-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,000 | 320 Segment | SPI | LCD | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11U68JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 48 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 36K x 8 | 2.4V ~ 3.6V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PCA85262ATT/AJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | PCA85262 | 6 µA | 1.8V ~ 5.5V | 48-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,000 | 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix | I²C | LCD | 8 Characters, 16 Characters, 128 Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11E67JBD48E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Exx | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 36 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 20K x 8 | 2.4V ~ 3.6V | A/D 8x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PSMN8R5-108ESQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -55°C ~ 175°C (TJ) | Through Hole | TO-262-3 Long Leads, I²Pak, TO-262AA | PSMN8 | MOSFET (Metal Oxide) | I2PAK | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8541.29.0095 | 50 | N-Channel | 108 V | 100A (Tj) | 10V | 8.5mOhm @ 25A, 10V | 4V @ 1mA | 111 nC @ 10 V | ±20V | 5512 pF @ 50 V | - | 263W (Tc) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. AFV09P350-04NR3 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | 105 V | Surface Mount | OM-780-4L | AFV09 | 920MHz | LDMOS | OM-780-4L | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322054528 | 5A991G | 8541.29.0040 | 250 | Dual | - | 860 mA | 100W | 19.5dB | - | 48 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC22XSD200BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC22XSD200 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070674518 | EAR99 | 8542.39.0001 | 1,000 | 3.3V ~ 5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 22mOhm | 8V ~ 36V | General Purpose | 3A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08SH16VTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314126534 | 3A991A2 | 8542.31.0001 | 5,000 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX280CVM4BR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX280 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323113518 | 5A992C | 8542.31.0001 | 1,000 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U5DVM10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. MM9Z1I638BM2EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | MM9Z1I638 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321951564 | EAR99 | 8542.39.0001 | 2,000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0100NPAEPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | 12 | Multiple | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F0ANESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315454528 | EAR99 | 8542.39.0001 | 4,000 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F3ANESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318204528 | EAR99 | 8542.39.0001 | 4,000 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S08RNA32W1MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 26 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal |
