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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S9S12VR48AF0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 28 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 6x10b | Internal | |||||
| NXP USA Inc. S9S12VR48F2CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | 1 (Unlimited) | REACH Unaffected | 935311005528 | OBSOLETE | 0000.00.0000 | 2,000 | 28 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 6x10b | Internal | |||||
| NXP USA Inc. S9S12VR64AF0CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323493557 | 3A991A2 | 8542.31.0001 | 1,250 | 16 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 2x10b | Internal | ||||
| NXP USA Inc. S9S12VR64AF0VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318018557 | 3A991A2 | 8542.31.0001 | 1,250 | 16 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 2x10b | Internal | ||||
| NXP USA Inc. S9S12XS128J1MALR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311884528 | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||||
| NXP USA Inc. S9S12XS128J1VAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 59 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||
| NXP USA Inc. S9S12XS256J0CAER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 44 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 12K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||
| NXP USA Inc. S9S12XS256J0VAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-QFP | S9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 750 | 59 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 12K x 8 | 1.72V ~ 5.5V | A/D 8x12b | External | |||||
| NXP USA Inc. S9S12XS256J0VALR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320277528 | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12X | 16-Bit | 40MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 12K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||||
| NXP USA Inc. S9S12ZVL16F0VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323727557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | ||||
| NXP USA Inc. S9S12ZVL32F0CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323812557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | ||||
| NXP USA Inc. S9S12ZVL32F0CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323812528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | ||||
| NXP USA Inc. S9S12ZVL32F0VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | |||||
| NXP USA Inc. S9S12ZVL8F0CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318914557 | 3A991A2 | 8542.31.0001 | 1,250 | 34 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | 128 x 8 | 512 x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | ||||
| NXP USA Inc. S9S12ZVLS1F0MFM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | S9S12 | 32-QFN-EP (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935332531557 | 3A991A2 | 8542.31.0001 | 490 | 19 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | ||||
| NXP USA Inc. S9S12ZVLS1F0VFMR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | S9S12 | 32-QFN-EP (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935345418578 | 3A991A2 | 8542.31.0001 | 2,500 | 19 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | ||||
| NXP USA Inc. S9S12ZVLS3F0CFM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | S9S12 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 19 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | |||||
| NXP USA Inc. S9S12ZVLS3F0VFM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | S9S12 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316319557 | 3A991A2 | 8542.31.0001 | 490 | 19 | S12Z | 16-Bit | 32MHz | I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | ||||
 |
NXP USA Inc. SAC57D53MCVLT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MAC57Dxxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-LQFP Exposed Pad | SAC57 | 208-LQFP (28x28) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316377557 | 5A992C | 8542.31.0001 | 180 | ARM® Cortex®-A5/M4/M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15V ~ 5.5V | A/D 24x12b | Internal | |||||
|
NXP USA Inc. SAC57D53MCVLTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MAC57Dxxx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-LQFP Exposed Pad | SAC57 | 208-LQFP (28x28) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316377528 | 5A992C | 8542.31.0001 | 180 | ARM® Cortex®-A5/M4/M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15V ~ 5.5V | A/D 24x12b | Internal | |||||
| NXP USA Inc. SAC57D53MCVMO | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MAC57Dxxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 516-BGA | SAC57 | 516-MAPBGA (27x27) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318864557 | 5A992C | 8542.31.0001 | 200 | ARM® Cortex®-A5/M4/M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15V ~ 5.5V | A/D 24x12b | Internal | ||||||
| NXP USA Inc. SAC57D53MCVMOR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MAC57Dxxx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 516-BGA | SAC57 | 516-MAPBGA (27x27) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318864518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A5/M4/M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | 3MB (3M x 8) | FLASH | - | 2.3M x 8 | 3.15V ~ 5.5V | A/D 24x12b | Internal | ||||||
|
NXP USA Inc. SAC57D54HCVLTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MAC57Dxxx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-LQFP Exposed Pad | SAC57 | 208-LQFP (28x28) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316435528 | 5A992C | 8542.31.0001 | 180 | ARM® Cortex®-A5/M4/M0+ | 32-Bit Tri-Core | 80MHz, 160MHz, 320MHz | CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI | DMA, LCD, LVD/HVD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 2.3M x 8 | 3.15V ~ 5.5V | A/D 24x12b | Internal | |||||
| NXP USA Inc. SC511660MZP40 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC5xx | Tray | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 272-BBGA | SC511660 | 272-PBGA (27x27) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309769557 | 3A991A2 | 8542.31.0001 | 200 | 101 | PowerPC | 32-Bit Single-Core | 40MHz | CANbus, EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 448KB (448K x 8) | FLASH | - | 26K x 8 | 2.5V ~ 2.7V | A/D 32x10b | External | |||||
|
NXP USA Inc. SFR4310E1MAE40R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Obsolete | SFR43 | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314001528 | OBSOLETE | 0000.00.0000 | 1,500 | |||||||||||||||||||||
| NXP USA Inc. SM912F634DV2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S/MM9 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP Exposed Pad | SM912F634 | 48-HLQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 935347725557 | EAR99 | 8542.31.0001 | 1,250 | 3 | S12 | 16-Bit | 20MHz | LINbus, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 4.5V ~ 5.5V | A/D 15x10b | Internal | |||||
| NXP USA Inc. SP5742PFK1AKLQ5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 135°C (TA) | Surface Mount | 144-LQFP | SP5742 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935326035528 | 3A991A2 | 8542.31.0001 | 500 | e200z4 | 32-Bit Dual-Core | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 1.5MB (1.5M x 8) | FLASH | - | 192K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||
| NXP USA Inc. SP5742PFK1AMLQ9R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SP5742 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333782528 | 3A991A2 | 8542.31.0001 | 500 | e200z4 | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 1.5MB (1.5M x 8) | FLASH | - | 192K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||
| NXP USA Inc. SP5744CBK1AVKU6R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SP5744 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935353776528 | 5A992C | 8542.31.0001 | 500 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||
| NXP USA Inc. SP5745BBK1AMMH2R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SP5745 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935339132518 | 5A992C | 8542.31.0001 | 1,500 | e200z4 | 32-Bit Single-Core | 120MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 256K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal |
