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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC9S08JM32CGT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324227557 | 3A991A2 | 8542.31.0001 | 1,300 | 37 | S08 | 8-Bit | 48MHz | I²C, LINbus, SCI, SPI, USB | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x12b | External | ||||
| NXP USA Inc. MC9S08JM32CLD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 33 | S08 | 8-Bit | 48MHz | I²C, LINbus, SCI, SPI, USB | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x12b | External | |||||
| NXP USA Inc. MC9S08JM32CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324228557 | 3A991A2 | 8542.31.0001 | 800 | 51 | S08 | 8-Bit | 48MHz | I²C, LINbus, SCI, SPI, USB | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | External | ||||
| NXP USA Inc. MC9S08JM60CGT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,300 | 37 | S08 | 8-Bit | 48MHz | I²C, LINbus, SCI, SPI, USB | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 8x12b | External | |||||
| NXP USA Inc. MC9S08JM60CQH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 420 | 51 | S08 | 8-Bit | 48MHz | I²C, LINbus, SCI, SPI, USB | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b | External | |||||
| NXP USA Inc. MC9S08QA2CPAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | MC9S08 | 8-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8542.31.0001 | 50 | 4 | S08 | 8-Bit | 20MHz | - | LVD, POR, PWM, WDT | 2KB (2K x 8) | FLASH | - | 160 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | |||||
| NXP USA Inc. MC9S08QA4CDNE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9S08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 98 | 4 | S08 | 8-Bit | 20MHz | - | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | |||||
| NXP USA Inc. MC9S08QA4CPAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | MC9S08 | 8-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935312279174 | EAR99 | 8542.31.0001 | 50 | 4 | S08 | 8-Bit | 20MHz | - | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | ||||
| NXP USA Inc. MC9S08QE128CLK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | MC9S08 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309893557 | 3A991A2 | 8542.31.0001 | 450 | 70 | S08 | 8-Bit | 50MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 24x12b | Internal | ||||
| NXP USA Inc. MC9S08QE4CWL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 26 | 22 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | |||||
| NXP USA Inc. MC9S08QE8CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319077557 | EAR99 | 8542.31.0001 | 1,250 | 26 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | ||||
| NXP USA Inc. MC9S08QE8CPG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | MC9S08 | 16-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935325212174 | EAR99 | 8542.31.0001 | 25 | 12 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||
| NXP USA Inc. MC9S08QG44CPAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | MC9S08 | 8-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 50 | 4 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | |||||
| NXP USA Inc. MC9S08QG84CDNE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9S08 | 8-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 98 | 4 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | |||||
| NXP USA Inc. MC9S08QG84CFQE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | MC9S08 | 8-DFN-EP (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 490 | 4 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | |||||
| NXP USA Inc. MC9S08QG84CPBE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | MC9S08 | 16-PDIP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 25 | 12 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S08SH4CPJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | MC9S08 | 20-DIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935320241174 | 3A991A2 | 8542.31.0001 | 18 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S08SH4CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314077574 | 3A991A2 | 8542.31.0001 | 75 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S08SH8CPJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | MC9S08 | 20-DIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935319115174 | 3A991A2 | 8542.31.0001 | 18 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S08SH8MPJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | MC9S08 | 20-DIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935319118174 | 3A991A2 | 8542.31.0001 | 18 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S08SH8MTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319119574 | 3A991A2 | 8542.31.0001 | 75 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S12XD64CAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313922557 | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | External | ||||
| NXP USA Inc. MC9S12XDG128CAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321073557 | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 12K x 8 | 2.35V ~ 5.5V | A/D 8x10b | External | ||||
| NXP USA Inc. MC9S12XDG128CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319087557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 12K x 8 | 2.35V ~ 5.5V | A/D 16x10b | External | ||||
| NXP USA Inc. MC9S12XEP100CAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | MC9S12 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325222557 | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||||
| NXP USA Inc. MC9S12XEP768CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313921557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 768KB (768K x 8) | FLASH | 4K x 8 | 48K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | ||||
| NXP USA Inc. MCF51QE128CLK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51QE | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | MCF51 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322826557 | 3A991A2 | 8542.31.0001 | 450 | 70 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 24x12b | Internal | ||||
| NXP USA Inc. MCF51QE32LH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51QE | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | MCF51 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324204557 | 3A991A2 | 8542.31.0001 | 800 | 54 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 20x12b | Internal | ||||
| NXP USA Inc. MCF52211CAE80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5221x | Tray | Last Time Buy | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MCF52211 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318577557 | 5A991B4B | 8542.31.0001 | 800 | 43 | Coldfire V2 | 32-Bit Single-Core | 80MHz | I²C, SPI, UART/USART, USB OTG | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | ||||
| NXP USA Inc. MCF52232AF50 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5223x | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | MCF52232 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A991B4B | 8542.31.0001 | 450 | 56 | Coldfire V2 | 32-Bit Single-Core | 50MHz | Ethernet, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal |
