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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S912ZVML12F3VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334917557 | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML12F3WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334919528 | 3A991A2 | 8542.31.0001 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML31F1WKFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | S912 | 48-LQFP-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318686528 | 3A991A2 | 8542.31.0001 | 2,000 | 31 | S12Z | 16-Bit | 40MHz | LINbus, SCI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 4x12b | Internal | ||||
| NXP USA Inc. S912ZVML32F3VKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||
| NXP USA Inc. S912ZVML32F3WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334924557 | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML64F3MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334926557 | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML64F3VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354756557 | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML64F3WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334928557 | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML64F3WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334928528 | 3A991A2 | 8542.31.0001 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S9KEAZ128AMLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9KEAZ128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
| NXP USA Inc. S9KEAZN32AMLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9KEAZN32 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323585528 | 3A991A2 | 8542.31.0001 | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||
| NXP USA Inc. S9KEAZN32AVLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9KEAZN32 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||
| NXP USA Inc. S9KEAZN64ACLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9KEAZN64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312098528 | 3A991A2 | 8542.31.0001 | 1,500 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||
 |
NXP USA Inc. S9KEAZN64AVLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9KEAZN64 | 32-TQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324986557 | 3A991A2 | 8542.31.0001 | 1,250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||
| NXP USA Inc. S9KEAZN8AMFKR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | S9KEAZN8 | 24-QFN (4x4) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320278528 | 3A991A2 | 8542.31.0001 | 5,000 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||
| NXP USA Inc. S9KEAZN8AMTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9KEAZN8 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | |||||
| NXP USA Inc. S9KEAZN8AVTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9KEAZN8 | 16-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||||
| NXP USA Inc. S9KEAZN8AVTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9KEAZN8 | 16-TSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,500 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||||
| NXP USA Inc. S9S08AW16AE0VLDR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322851528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW16E5CFDE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | S9S08 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316872557 | 3A991A2 | 8542.31.0001 | 1,300 | 38 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW16E5CFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309684528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E5CFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315129528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E5MFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316847528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E5VFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||||
| NXP USA Inc. S9S08AW32E7CFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313378528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E7VFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315019528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW48E5CFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319282528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW48E5MPUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316965528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. S9S08AW48E5VFDE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | S9S08 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,300 | 38 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||||
| NXP USA Inc. S9S08AW48E5VPUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323359557 | 3A991A2 | 8542.31.0001 | 800 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal |
