Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Frequency | Current - Supply | Voltage - Input | Output Type | Sensitivity | Digi-Key Programmable | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Data Rate (Max) | Number of Outputs | Memory Size | Fault Protection | Output Configuration | Serial Interfaces | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) | Power - Output | RF Family/Standard | Modulation | Current - Receiving | Current - Transmitting | GPIO |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. TEA1999TS/2H | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | GreenChip™ | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Active/Synchronous Rectification Controller | Surface Mount | SC-74, SOT-457 | TEA1999 | 250 µA | - | Not Verified | 0V ~ 21V | SC-74 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC54S016JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC540xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC54S016 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | ROMless | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. QN9080-001-M17Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 54-LFLGA | TxRx + MCU | QN9080 | 2.4GHz ~ 2.4835GHz | -92.7dBm | Not Verified | 1.67V ~ 3.6V | 54-LFLGA (9.7x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343646515 | 5A992C | 8542.39.0001 | 600 | Bluetooth v5.0 | 2Mbps | 512kB Flash, 128kB SRAM | ADC, GPIO, I²C, SPI, UART, USART, USB | 2dBm | Bluetooth | FSK | 4mA | 3.5mA | 32 | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM4DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM4 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM4CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM4 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378343557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM2CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM2 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 1 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM1DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM1 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 1 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL4CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL4CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL32CQH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 84 | 57 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL8CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 6x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL8CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 10x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5775BDK3MME2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BGA | SPC5775 | 416-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | 293 | e200z7 | 32-Bit Dual-Core | 220MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 40x12b eQADCx2 | External | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC10XS6225BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC10XS6225 | - | - | - | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 10mOhm, 25mOhm | 7V ~ 18V | General Purpose | 4.5A, 9A | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC10XS6325BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC10XS6325 | - | - | - | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 3 | Open Load Detect, Over Temperature | High Side | 10mOhm, 25mOhm | 7V ~ 18V | General Purpose | 4.5A, 9A | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC17XS6500CEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM | MC17XS6500 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC17XS6400CEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC17XS6400 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 5 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC10XS6225BEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC10XS6225 | - | - | - | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934071652574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 10mOhm, 25mOhm | 7V ~ 18V | General Purpose | 4.5A, 9A | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MQ6CVAHZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MQ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 621-FBGA, FCBGA | MIMX8MQ6 | 621-FCPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A53 | 1.3GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | EBI/EMI, I²C, PCIe, SPI, UART, uSDHC | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC56F82623VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC56F82 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | 56800EX | 32-Bit Single-Core | 100MHz | SCI | DMA, LVD, POR, PWM, WDT | 32KB (16K x 16) | FLASH | - | 8K x 8 | 2.7V ~ 3.6V | A/D 6x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Z0DVM09AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 900MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | Keypad | - | - | USB 2.0 OTG + PHY (2) | - | A-HAB, ARM TZ, CSU, SJC, SNVS | eCSPI, ESAI, I²C, MMC/SD/SDIO, SAI, SPI, UART, USB | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8201A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8 Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8201 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC32PF8121A0EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Industrial, IoT | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC32PF8121 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8100CFES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935375839557 | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC34PF8100CCEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC34PF8100CHEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935383913557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200CLES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33PF8200CXES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382504557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX280DVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -20°C ~ 70°C (TA) | Surface Mount | 289-LFBGA | MCIMX280 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369765557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Please send RFQ , we will respond immediately.