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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Output Type | Digi-Key Programmable | Ratio - Input:Output | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
NXP USA Inc. MC9S08AC32CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC9S08AC32CFUE | 3A991A2 | 8542.31.0000 | 102 | 54 | HCS08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b SAR | Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. MK22DN512VLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | K22 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22DN512 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MK22DN512VLH5 | 3A991A2 | 8542.31.0000 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART, USB | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 18x16b SAR; D/A 1x12b | Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. MCHC11F1VFNE4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | M68HC11 | Tape & Reel (TR) | Last Time Buy | -40°C ~ 105°C (TA) | Surface Mount | 68-LCC (J-Lead) | MCHC11 | 68-PLCC | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MCHC11F1VFNE4RTR | EAR99 | 8542.31.0000 | 6 | 54 | M68HC11 | 8-Bit | 4MHz | SCI, SPI | POR, WDT | - | ROMless | 512 x 8 | 1K x 8 | 4.75V ~ 5.25V | A/D 8x8b SAR | External, Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. MPC860TCZQ66D4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Bulk | Obsolete | -40°C ~ 95°C (TJ) | Surface Mount | 357-BBGA | 357-PBGA (25x25) | RoHS non-compliant | 3 (168 Hours) | REACH info available upon request | 2832-MPC860TCZQ66D4 | 5A991B4B | 8542.31.0000 | 1 | MPC860 | 66MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (4), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||||||||||||||
|
NXP USA Inc. S912XHZ512F1VAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-S912XHZ512F1VAL | EAR99 | 8542.31.0000 | 11 | 85 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, LVD, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35V ~ 5.5V | A/D 16x10b SAR | External | ||||||||||||||||||||||||||||
|
NXP USA Inc. MC68302EH20C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC68302EH20C | 3A991A2 | 8542.31.0000 | 6 | M68000 | 20MHz | 1 Core, 8/16-Bit | Communications; RISC CPM | DRAM | No | - | - | - | - | 5V | - | GCI, IDL, ISDN, NMSI, PCM, SCPI | ||||||||||||||||||||||||||||
|
NXP USA Inc. MK20DX128VFT5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MK20DX128 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MK20DX128VFT5 | 3A991A2 | 8542.31.0000 | 260 | 29 | ARM® Cortex®-M4 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART, USB | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 16K x 8 | 1.71V ~ 3.6V | A/D 11x16b SAR | Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. MC56F8013MFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8000 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | MC56F80 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC56F8013MFAE | 3A991A2 | 8542.31.0000 | 31 | 26 | 56800E | 16-Bit | 32MHz | I²C, LINbus, SCI, SPI | POR, PWM, WDT | 16KB (8K x 16) | FLASH | - | 2K x 16 | 3V ~ 3.6V | A/D 6x12b | Internal | ||||||||||||||||||||||||||||
|
NXP USA Inc. MKL13Z64VLH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | KL17 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKL13Z64 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MKL13Z64VLH4 | 3A991A2 | 8542.31.0000 | 160 | 54 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | FlexIO, I²C, IrDA, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 3.6V | A/D 24x16b SAR; D/A 1x12b | Internal | ||||||||||||||||||||||||||||
| NXP USA Inc. LPC5534JHI48/00E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | LPC5534 | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 32 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | |||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V232CTN1VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | ROHS3 Compliant | REACH Unaffected | 568-FS32V232CTN1VUB | OBSOLETE | 1 | ARM® Cortex®-A53 | 1GHz | 2 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V232CKN2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V232CKN2VUB | 1 | ARM® Cortex®-A53 | 1GHz | 2 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234BLN2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V234BLN2VUB | 1 | ARM® Cortex®-A53 | 800MHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234CON2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 568-FS32V234CON2VUB | 1 | ARM® Cortex®-A53 | 1GHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234CON2VUBR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V234CON2VUBR | 1 | ARM® Cortex®-A53 | 1GHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V232CKN2VUBR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V232CKN2VUBR | 1 | ARM® Cortex®-A53 | 1GHz | 2 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||
|
NXP USA Inc. MF0ULH3101DUDV | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | Not Verified | REACH Unaffected | 568-MF0ULH3101DUDV | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. S912D60AE0MFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | S912 | REACH Unaffected | OBSOLETE | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAC7136J1VVF50R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | SAC71 | REACH Unaffected | OBSOLETE | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. XC912BC32CFUE8R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | XC912 | REACH Unaffected | OBSOLETE | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. CA/HY/8113/NF/PLBZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Last Time Buy | 568-CA/HY/8113/NF/PLBZ | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. CA/HY/8113/NF/PLAZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Last Time Buy | 568-CA/HY/8113/NF/PLAZ | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. CA/C/8113/POALIM/Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Last Time Buy | 568-CA/C/8113/POALIM/Z | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F80746MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F80xxx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EF | 32-Bit | 100MHz | I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 3.6V | A/D 14x12b | External, Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F80646VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F80xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MC56F80646VLF | 1,250 | 39 | 56800EF | 32-Bit | 100MHz | I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 3.6V | A/D 14x12b | External, Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F80726VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F80xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 568-MC56F80726VLF | 1,250 | 39 | 56800EF | 32-Bit | 100MHz | I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 6K x 8 | 2.7V ~ 3.6V | A/D 14x12b | External, Internal | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F80746VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F80xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 568-MC56F80746VLF | 1,250 | 39 | 56800EF | 32-Bit | 100MHz | I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 3.6V | A/D 14x12b | External, Internal | ||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC33XS2410EL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tube | Active | -40°C ~ 150°C (TJ) | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | Load Discharge, Slew Rate Controlled | Non-Inverting | N-Channel | 1:4 | 28-HTSSOP | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 50 | Not Required | SPI | 4 | Current Limiting (Fixed), Over Load, Over Temperature, Over Voltage, Short Circuit, UVLO | High Side | 100mOhm | 3V ~ 60V | General Purpose | 3.6A | ||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32K148HAT0VLQR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-FS32K148HAT0VLQRTR | 500 | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC33FS8510A0ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | ROHS3 Compliant | 568-MC33FS8510A0ESR2TR | 4,000 |
