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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC9S08RD8FJE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MCHC705B16NVFNE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC05 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 52-LCC (J-Lead) | MCHC705 | 52-PLCC (19.1x19.1) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 23 | 32 | HC05 | 8-Bit | 2.1MHz | SCI | POR, WDT | 15KB (15K x 8) | OTP | 256 x 8 | 352 x 8 | 4.5V ~ 5.5V | A/D 8x8b | Internal | |||||
| NXP USA Inc. MC9S12C96CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 750 | 60 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 96KB (96K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC68HC16Z1VEH16 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC16 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 132-BQFP Bumpered | MC68HC16 | 132-PQFP (24.13x24.13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 180 | 16 | CPU16 | 16-Bit | 16MHz | EBI/EMI, SCI, SPI | POR, PWM, WDT | - | ROMless | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC912DG128ACPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC912 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 500 | 69 | CPU12 | 16-Bit | 8MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 16x8/10b | Internal | |||||
| NXP USA Inc. MC9S08RD32CDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 26 | 23 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RD32PE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | MC9S08 | 28-PDIP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 13 | 23 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RD60CDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 26 | 23 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RD60DWE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 26 | 23 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RD60PE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | MC9S08 | 28-PDIP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 13 | 23 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RD8PE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | MC9S08 | 28-PDIP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 13 | 23 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RE16CFDE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 260 | 39 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RE16CFDER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RE16FDE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 260 | 39 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S08RE16FDER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 8MHz | SCI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 1.8V ~ 3.6V | - | Internal | |||||
| NXP USA Inc. MC9S12A128CFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309411557 | EAR99 | 8542.31.0001 | 420 | 59 | HCS12 | 16-Bit | 25MHz | I²C, SCI, SPI | PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.35V ~ 5.25V | A/D 16x10b | Internal | ||||
| NXP USA Inc. MC9S12B128CPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 500 | 91 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | 1K x 8 | 4K x 8 | 2.35V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. MC9S12C128CPBE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 52-LQFP | MC9S12 | 52-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 800 | 35 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S12C128CPBER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 52-LQFP | MC9S12 | 52-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 500 | 35 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S12C128MPBER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 52-LQFP | MC9S12 | 52-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 500 | 35 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S12C32CFUE25 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325183557 | EAR99 | 8542.31.0001 | 420 | 60 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S12C32MFUE16 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323997556 | EAR99 | 8542.31.0001 | 84 | 60 | HCS12 | 16-Bit | 16MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S12C32MFUE25R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 750 | 60 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S12C32VFAE25 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,250 | 31 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S12C32VFUE16 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325184557 | EAR99 | 8542.31.0001 | 420 | 60 | HCS12 | 16-Bit | 16MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S12C32VPBE16 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 52-LQFP | MC9S12 | 52-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316612557 | EAR99 | 8542.31.0001 | 800 | 35 | HCS12 | 16-Bit | 16MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S12C64MFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309432557 | EAR99 | 8542.31.0001 | 420 | 60 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S12C96CFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | MC9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,250 | 31 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 96KB (96K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S12C96MFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 1,250 | 31 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 96KB (96K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S12C96MPBE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 52-LQFP | MC9S12 | 52-TQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 160 | 35 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, WDT | 96KB (96K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 5.5V | A/D 8x10b | Internal |
