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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Current - Supply | Number of Channels | Output Type | Number of Circuits | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current - Output High, Low | Voltage - Supply, Single/Dual (±) | Slew Rate | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Data Rate | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Input Signal | Output Signal | Voltage Supply Source | Circuit | Independent Circuits | Translator Type | Channel Type | Channels per Circuit | Internal Switch(s) | Programmable Features | Current - Output (Max) | Current - Max | Power Dissipation (Max) | Capacitance @ Vr, F | Diode Type | Voltage - Peak Reverse (Max) | Resistance @ If, F |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC9S08DZ60MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08DZ60MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 53 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 24x12b | External | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8321ZQADDC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Box | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 516-BBGA | KMPC83 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A3 | 8542.31.0001 | 2 | PowerPC e300c2 | 266MHz | 1 Core, 32-Bit | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | - | DUART, I²C, PCI, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8323CZQAFDC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Box | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 516-BBGA | KMPC83 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 2 | PowerPC e300c2 | 333MHz | 1 Core, 32-Bit | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | - | DUART, I²C, PCI, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8323EZQAFDC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Box | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 516-BBGA | KMPC83 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 2 | PowerPC e300c2 | 333MHz | 1 Core, 32-Bit | Communications; QUICC Engine, Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | Cryptography | DUART, I²C, PCI, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8323ZQADDC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Box | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 516-BBGA | KMPC83 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 2 | PowerPC e300c2 | 266MHz | 1 Core, 32-Bit | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | - | DUART, I²C, PCI, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8347CZQAGDB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 620-BBGA Exposed Pad | KMPC83 | 620-HBGA (29x29) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 2 | PowerPC e300 | 266MHz | 1 Core, 32-Bit | - | DDR | No | - | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | - | DUART, I²C, PCI, SPI | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8347CZUAJDB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 672-LBGA | KMPC83 | 672-LBGA (35x35) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 2 | PowerPC e300 | 533MHz | 1 Core, 32-Bit | - | DDR | No | - | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | - | DUART, I²C, PCI, SPI | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08DN16CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 25 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08DN16MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 25 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08QD2CSCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9S08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,500 | 4 | S08 | 8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCF52100CVM66 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF521xx | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 81-LBGA | MCF52100 | 81-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A991B4B | 8542.31.0001 | 240 | 56 | Coldfire V2 | 32-Bit Single-Core | 66MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCF52110CAF80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF521xx | Tray | Last Time Buy | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | MCF52110 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 63 | Coldfire V2 | 32-Bit Single-Core | 66MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCF52110CVM80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF521xx | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 81-LBGA | MCF52110 | 81-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A991B4B | 8542.31.0001 | 1,200 | 56 | Coldfire V2 | 32-Bit Single-Core | 80MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCF52210CEP66 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5221x | Box | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | MCF52210 | 64-QFN-EP (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A991B4B | 8542.31.0001 | 260 | 43 | Coldfire V2 | 32-Bit Single-Core | 66MHz | I²C, SPI, UART/USART, USB OTG | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCF52211CVM66 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5221x | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 81-LBGA | MCF52211 | 81-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A991B4B | 8542.31.0001 | 1,200 | 55 | Coldfire V2 | 32-Bit Single-Core | 66MHz | I²C, SPI, UART/USART, USB OTG | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCZ34652EFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | -48V | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | Hot Swap Controller | Auto Retry, Thermal Limit | MCZ34652 | 900 µA | 1 | -80V ~ -15V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,500 | Yes | Current Limit, Fault Timeout, OVP, UVLO | 2A | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MPC5200VR400BR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC52xx | Tape & Reel (TR) | Obsolete | 0°C ~ 70°C (TA) | Surface Mount | 272-BBGA | MPC52 | 272-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A3 | 8542.31.0001 | 500 | PowerPC e300 | 400MHz | 1 Core, 32-Bit | - | DDR, SDRAM | No | - | 10/100Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | - | AC97, CAN, J1850, I²C, I²S, IrDA, PCI, PSC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5200CBV400B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC52xx | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 272-BBGA | SPC5200CBV400 | 272-PBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 935316933557 | 3A991A2 | 8542.31.0001 | 200 | PowerPC G2_LE | 400MHz | 1 Core, 32-Bit | - | DDR, SDRAM | No | - | 10/100Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | - | AC97, CAN, J1850, I²C, I²S, IrDA, PCI, PSC, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8321CZQAFDC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Box | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 516-BBGA | KMPC83 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A3 | 8542.31.0001 | 2 | PowerPC e300c2 | 333MHz | 1 Core, 32-Bit | Communications; QUICC Engine | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | - | DUART, I²C, PCI, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. KMPC8321ECZQAFDC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC83xx | Box | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 516-BBGA | KMPC83 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 2 | PowerPC e300c2 | 333MHz | 1 Core, 32-Bit | Communications; QUICC Engine, Security; SEC 2.2 | DDR, DDR2 | No | - | 10/100Mbps (3) | - | USB 2.0 (1) | 1.8V, 2.5V, 3.3V | Cryptography | DUART, I²C, PCI, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. BAP70AM,115 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -65°C ~ 150°C (TJ) | 6-TSSOP, SC-88, SOT-363 | BAP70 | 6-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8541.10.0070 | 3,000 | 100 mA | 300 mW | 0.25pF @ 20V, 1MHz | PIN - 2 Pair Series | 50V | 1.9Ohm @ 100mA, 100MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. CBT3857PW,118 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74CBT | Tape & Reel (TR) | Obsolete | 0°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | Bus Switch | CBT38 | 3V ~ 3.6V | 24-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | - | Single Supply | 10 x 1:1 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. CBTU4411EE,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | CBT | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 72-LFBGA | Bus Switch | CBTU44 | 1.7V ~ 1.9V | 72-LFBGA (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 416 | - | Single Supply | 11 x 4:1 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. CGD1044H,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | CATV | Chassis Mount | SOT-115J | CGD10 | 450 mA | - | 1 | SOT115J | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 25 | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. GTL2012DC,125 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-VFSOP (0.091", 2.30mm Width) | - | GTL2012 | Non-Inverted | 1 | 8-VSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | - | LVTTL | GTL | Mixed Signal | Bidirectional | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC2103FBD48,118 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC2100 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC2103 | 48-LQFP (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 32 | ARM7® | 16/32-Bit | 70MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.65V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC2119FBD64/01,15 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC2100 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC2119 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 46 | ARM7® | 16/32-Bit | 60MHz | CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART | POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 3.6V | A/D 4x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC2124FBD64/01,15 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC2100 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC2124 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 46 | ARM7® | 16/32-Bit | 60MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 3.6V | A/D 4x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC2194HBD64/01,15 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC2100 | Tray | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | LPC2194 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 46 | ARM7® | 16/32-Bit | 60MHz | CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART | POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 3.6V | A/D 4x10b | Internal |
