Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
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NXP USA Inc. MC9S08DZ48MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 3K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||||||
NXP USA Inc. MC9S08JM32CQH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319406557 | 3A991A2 | 8542.31.0001 | 420 | 51 | S08 | 8-Bit | 48MHz | I²C, LINbus, SCI, SPI, USB | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | External | ||||
NXP USA Inc. MC9S08JM60CLD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 33 | S08 | 8-Bit | 48MHz | I²C, LINbus, SCI, SPI, USB | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 8x12b | External | |||||
NXP USA Inc. MC9S08QA4CFQE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-VDFN Exposed Pad | MC9S08 | 8-DFN-EP (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,450 | 4 | S08 | 8-Bit | 20MHz | - | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | |||||
NXP USA Inc. MC9S08QE128CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313941557 | 3A991A2 | 8542.31.0001 | 800 | 54 | S08 | 8-Bit | 50MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 22x12b | Internal | ||||
NXP USA Inc. MC9S08QE4CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317002557 | EAR99 | 8542.31.0001 | 1,250 | 26 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | ||||
NXP USA Inc. MC9S08QE4CPG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | MC9S08 | 16-PDIP | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935325179174 | EAR99 | 8542.31.0001 | 25 | 12 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||
NXP USA Inc. MC9S08QE4CWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 38 | 16 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | |||||
NXP USA Inc. MC9S08QE8CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313817574 | EAR99 | 8542.31.0001 | 96 | 12 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||
NXP USA Inc. MC9S08QE8CWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319078574 | EAR99 | 8542.31.0001 | 38 | 16 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||
NXP USA Inc. MC9S08QE8CWL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 26 | 22 | S08 | 8-Bit | 20MHz | I²C, LINbus, SCI, SPI | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | |||||
NXP USA Inc. MC9S08QG44CFFE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 16-VQFN Exposed Pad | MC9S08 | 16-QFN-EP (5x5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 490 | 12 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||
NXP USA Inc. MC9S08QG44CFFER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 16-VQFN Exposed Pad | MC9S08 | 16-QFN-EP (5x5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,500 | 12 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||
NXP USA Inc. MC9S08QG44CFKE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | MC9S08 | 24-QFN-EP (4x4) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 490 | 12 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||
NXP USA Inc. MC9S08QG84CDNER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9S08 | 8-SOIC | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,500 | 4 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | |||||
NXP USA Inc. MC9S08QG84CFFE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 16-VQFN Exposed Pad | MC9S08 | 16-QFN-EP (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 490 | 12 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||
NXP USA Inc. MC9S08SH4CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
NXP USA Inc. MC9S08SH4MPJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | MC9S08 | 20-DIP | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991A2 | 8542.31.0001 | 18 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||||
NXP USA Inc. MC9S08SH4MTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316602574 | 3A991A2 | 8542.31.0001 | 96 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||
NXP USA Inc. MC9S08SH8MSC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9S08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 98 | 5 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | |||||
NXP USA Inc. MC9S12XEP768MAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | MC9S12 | 144-LQFP (20x20) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 60 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 768KB (768K x 8) | FLASH | 4K x 8 | 48K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||
NXP USA Inc. MC9S12XHZ512CAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | MC9S12 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319106557 | 3A991A2 | 8542.31.0001 | 300 | 117 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35V ~ 5.5V | A/D 16x8/10b | External | ||||
NXP USA Inc. MC9S12XHZ512CAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313598557 | 3A991A2 | 8542.31.0001 | 300 | 85 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 32K x 8 | 2.35V ~ 5.5V | A/D 16x8/10b | External | ||||
NXP USA Inc. MCF51QE128CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51QE | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MCF51 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322825557 | 3A991A2 | 8542.31.0001 | 800 | 54 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 20x12b | Internal | ||||
NXP USA Inc. MCF51QE96CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF51QE | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MCF51 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 54 | Coldfire V1 | 32-Bit Single-Core | 50MHz | I²C, SCI, SPI | LVD, PWM, WDT | 96KB (96K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 20x12b | Internal | |||||
NXP USA Inc. MCF52210CAE80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5221x | Tray | Last Time Buy | -40°C ~ 85°C | Surface Mount | 64-LQFP | MCF52210 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316951557 | 5A991B4B | 8542.31.0001 | 160 | 43 | Coldfire V2 | 32-Bit Single-Core | 80MHz | I²C, SPI, UART/USART, USB OTG | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | ||||
NXP USA Inc. MCF52213AE50 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5221x | Tray | Last Time Buy | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | MCF52213 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 56 | Coldfire V2 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART, USB OTG | DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | |||||
NXP USA Inc. MCF52236AF50 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5223x | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 80-LQFP | MCF52236 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323992557 | 5A991B4B | 8542.31.0001 | 450 | 56 | Coldfire V2 | 32-Bit Single-Core | 50MHz | Ethernet, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 3V ~ 3.6V | A/D 8x12b | Internal | ||||
NXP USA Inc. MCF53721CVM240 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF537x | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 196-LBGA | MCF53721 | 196-LBGA (15x15) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316806557 | 5A002A1 | 8542.31.0001 | 630 | 62 | Coldfire V3 | 32-Bit Single-Core | 240MHz | EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | DMA, POR, PWM, WDT | - | ROMless | - | 32K x 8 | 1.4V ~ 3.6V | - | External | ||||
NXP USA Inc. MCF54450CVM180 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 256-LBGA | MCF54450 | 256-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319374557 | 5A002A1 | 8542.31.0001 | 450 | 132 | Coldfire V4 | 32-Bit Single-Core | 180MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | Internal |
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