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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC9S08SE4VWL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 26 | 24 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, POR, PWM | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S08SE8VWL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 26 | 24 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, POR, PWM | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 10x10b | Internal | |||||
| NXP USA Inc. MC9S08SH16CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318383574 | 3A991A2 | 8542.31.0001 | 96 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S08SH16CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 5,000 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S08SH16CWLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 23 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. MC9S08SH16MTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S08SH16VTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 75 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||
| NXP USA Inc. MC9S08SH16VTL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | MC9S08 | 28-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 50 | 23 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. MC9S08SH32CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317014574 | 3A991A2 | 8542.31.0001 | 96 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S08SH32CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325428574 | 3A991A2 | 8542.31.0001 | 75 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S08SH32VTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S08SH32VTL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | MC9S08 | 28-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 50 | 23 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. MC9S08SH32VWL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | MC9S08 | 28-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 26 | 23 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. MC9S08SH4CWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316505574 | 3A991A2 | 8542.31.0001 | 38 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S08SH4MFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | MC9S08 | 24-QFN-EP (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||
| NXP USA Inc. MC9S08SH4MTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 5,000 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S08SH8CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 5,000 | 13 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. MC9S08SH8CTJR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 5,000 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||
| NXP USA Inc. MC9S08SH8CWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MC9S08 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321398574 | 3A991A2 | 8542.31.0001 | 38 | 17 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||
| NXP USA Inc. MC9S08SV8CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | MC9S08 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 30 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 768 x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | |||||
| NXP USA Inc. MC9S12P128MQK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310082557 | 3A991A2 | 8542.31.0001 | 420 | 64 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||
| NXP USA Inc. MC9S12P32CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | MC9S12 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314125557 | 3A991A2 | 8542.31.0001 | 1,300 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 4K x 8 | 2K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||
| NXP USA Inc. MC9S12P64CQK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325478557 | 3A991A2 | 8542.31.0001 | 420 | 64 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 4K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||
| NXP USA Inc. MC9S12XD128MAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Not For New Designs | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | MC9S12 | 112-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325431557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35V ~ 5.5V | A/D 16x10b | External | ||||
| NXP USA Inc. MC9S12XEG128MAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 80-QFP | MC9S12 | 80-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321287557 | 3A991A2 | 8542.31.0001 | 420 | 59 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 12K x 8 | 1.72V ~ 5.5V | A/D 12x12b | External | ||||
| NXP USA Inc. MC9S12XEQ384CAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | MC9S12 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316976557 | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||||
| NXP USA Inc. S9S08AW60E5VPUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324266557 | 3A991A2 | 8542.31.0001 | 800 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | ||||
| NXP USA Inc. S9S08DZ128F2MLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | S9S08 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 87 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.7V ~ 5.5V | A/D 24x12b | Internal | |||||
| NXP USA Inc. S9S08DZ60F1CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||||||
| NXP USA Inc. S9S08DZ60F1CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 2K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External |
