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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Frequency | Current - Supply | Battery Chemistry | Number of Cells | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Standards | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC32PF1550A7EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370637557 | EAR99 | 8542.39.0001 | 2,450 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F8335VFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 128-LQFP | MC56F83 | 128-LQFP (14x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318991518 | 3A991A2 | 8542.31.0001 | 700 | 49 | 56800E | 16-Bit | 60MHz | CANbus, EBI/EMI, SCI, SPI | POR, PWM, Temp Sensor, WDT | 64KB (32K x 16) | FLASH | - | 6K x 16 | 2.25V ~ 3.6V | A/D 16x12b | External | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PA4AVSC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9S08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 98 | 4 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PA4AVTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 75 | 4 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U1AVM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369117557 | 5A002A1 | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U4AVM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369136557 | 5A002A1 | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. MF0UL2101DUD2A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MIFARE® Ultralight | Tape & Reel (TR) | Active | -25°C ~ 70°C | Surface Mount | Die | RFID Transponder | MF0UL2101 | 13.56MHz | - | Die | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935353596046 | 0000.00.0000 | 236,693 | ISO 14443, MIFARE | - | |||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MF1P2121DA6/02BJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | - | - | - | MF1P2121 | - | - | - | ROHS3 Compliant | REACH Unaffected | 935360793118 | OBSOLETE | 0000.00.0000 | 17,500 | - | - | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MWCT1014SFVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | General Purpose | Surface Mount | 64-LQFP | MWCT1014 | - | 2.7V ~ 5.5V | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 800 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MWCT1014SFVLLN | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | General Purpose | Surface Mount | 100-LQFP | MWCT1014 | - | 2.7V ~ 5.5V | 100-LQFP (14x14) | download | ROHS3 Compliant | REACH Unaffected | 935352793557 | EAR99 | 8542.39.0001 | 450 | ||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. NTB0101GS1XL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | - | Surface Mount | 6-XFDFN | - | NTB0101 | - | - | - | 6-X2SON (1x1) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935362915132 | 5A991B1 | 8542.39.0001 | 5,000 | - | - | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. NX30P6093UKAZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | NX3 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-UFBGA, WLCSP | Slew Rate Controlled | NX30P6093 | - | P-Channel | 1:1 | 20-WLCSP (2.16x1.7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | 3V ~ 4.5V | I²C | 1 | Over Temperature, Over Voltage, UVLO | - | 8.95mOhm | 2.8V ~ 20V | USB Switch | 8A | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. PCA9468UKZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Obsolete | PCA9468 | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935339817012 | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVL64F0CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935367776528 | 3A991A2 | 8542.31.0001 | 2,000 | 34 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 10x10b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVLA12F0CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369304557 | 3A991A2 | 8542.31.0001 | 1,250 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b; D/A 1x8b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVLA12F0CLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S912 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369304528 | 3A991A2 | 8542.31.0001 | 2,000 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b; D/A 1x8b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5602BAMLL4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | SPC5602 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370082557 | 3A991A2 | 8542.31.0001 | 450 | 79 | e200z0h | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 64K x 8 | 24K x 8 | 3V ~ 5.5V | A/D 28x10b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5744PK1AMLQ5R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5744 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325044528 | 3A991A2 | 8542.31.0001 | 500 | 79 | e200z4 | 32-Bit Dual-Core | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5746BBK1AMMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5746 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935368953557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5747CFK0AVMJ6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370096557 | 5A992C | 8542.31.0001 | 450 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5775EDK3MME3 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BGA | SPC5775 | 416-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | 293 | e200z7 | 32-Bit Dual-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 40x12b eQADCx2 | External | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5775EDK3MME3R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BGA | SPC5775 | 416-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370091518 | 5A992C | 8542.31.0001 | 500 | 293 | e200z7 | 32-Bit Dual-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 40x12b eQADCx2 | External | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5777CDK3MME4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BGA | SPC5777 | 416-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | e200z7 | 32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 16b Sigma-Delta, eQADC | Internal | |||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TFA9874DUK/N1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | - | - | - | - | TFA9874 | - | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935363028062 | 0000.00.0000 | 2,000 | - | ||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TFA9888UK/N1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 99-UFBGA, WLCSP | Class D | Depop, I²C,Short-Circuit and Thermal Protection, Volume Control | TFA9888 | 2-Channel (Stereo) | 1.65V ~ 1.95V | 99-WLSCP (4.37x3.82) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935295552062 | EAR99 | 8542.33.0001 | 2,000 | 3.5W x 1 @ 8Ohm; 4.8W x 2 @ 8Ohm | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BSP1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935349661528 | EAR99 | 8542.39.0001 | 1,500 | Battery Cell Controller | SPI | Over/Under Voltage | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BSA1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935349742528 | EAR99 | 8542.39.0001 | 1,500 | Battery Cell Controller | SPI | Over/Under Voltage | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BTP2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935350622557 | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | TPL | Over/Under Voltage | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BTP2AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935350622528 | EAR99 | 8542.39.0001 | 1,500 | Battery Cell Controller | TPL | Over/Under Voltage | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BSA2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935350994557 | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | SPI | Over/Under Voltage |
