+86 13691825231
jerry@srdic.cn-
ALL Products
- Passive
- Audio Products
-
Circuit Protection
- Circuit Breakers
- Circuit Protection Accessories
- Electrical, Specialty Fuses
- Fuseholders
- Fuses
- Gas Discharge Tube Arresters (GDT)
- Ground Fault Circuit Interrupter (GFCI)
- Inrush Current Limiters (ICL)
- Lighting Protection
- PTC Resettable Fuses
- Surge Suppression Ics
- Thermal Cutoffs (Thermal Fuses)
- Transient Voltage Suppressors (TVS)
-
Connectors, Interconnects
- AC Power Connectors
- Backplane Connectors
- Banana and Tip Connectors
- Barrel Connectors
- Between Series Adapters
- Blade Type Power Connectors
- Card Edge Connectors
- Circular Connectors
- Coaxial Connectors (RF)
- Contacts
- D-Sub, D-Shaped Connectors
- FFC, FPC (Flat Flexible) Connectors
- Fiber Optic Connectors
- Heavy Duty Connectors
- Keystone Connectors
- LGH Connectors
- Memory Connectors
- Modular Connectors
- Photovoltaic (Solar Panel) Connectors
- Pluggable Connectors
- Rectangular Connectors
- Shunts, Jumpers
- Sockets for ICs, Transistors
- Solid State Lighting Connectors
- Terminal Blocks
- Terminal Junction Systems
- Terminal Strips and Turret Boards
- Terminals
- USB, DVI, HDMI Connectors
- Discrete Semiconductor Products
- Integrated Circuits (ICs)
- Memory Cards, Modules
- Relays
-
RF/IF and RFID
- Attenuators
- Balun
- RF Accessories
- RF Amplifiers
- RF Antennas
- RF Circulators and Isolators
- RF Demodulators
- RF Detectors
- RF Directional Coupler
- RF Front End (LNA + PA)
- RF Misc ICs and Modules
- RF Mixers
- RF Modulators
- RF Multiplexers
- RF Power Controller ICs
- RF Power Dividers/Splitters
- RF Receiver, Transmitter, and Transceiver Finished
- RF Receivers
- RF Shields
- RF Switches
- RF Transceiver ICs
- RF Transceiver Modules and Modems
- RF Transmitters
- RFI and EMI - Contacts, Fingerstock and Gaskets
- RFI and EMI - Shielding and Absorbing Materials
- RFID Accessories
- RFID Antennas
- RFID Reader Modules
- RFID Transponders, Tags
- RFID, RF Access, Monitoring ICs
- Subscriber Identification Module (SIM) Cards
-
Sensors, Transducers
- Color Sensors
- Color Sensors - Industrial
- Current Sensors
- Encoders
- Encoders - Industrial
- Float, Level Sensors
- Float, Level Sensors - Industrial
- Flow Sensors
- Flow Sensors - Industrial
- Force Sensors
- Force Sensors - Industrial
- Gas Sensors
- Humidity, Moisture Sensors)
- IrDA Transceiver Modules
- LVDT Transducers (Linear Variable Differential Tra
- Magnetic Sensors
- Magnets
- Motion Sensors
- Multifunction
- Optical Sensors
- Particle, Dust Sensors
- Position Sensors
- Pressure Sensors, Transducers
- Pressure Sensors, Transducers - Industrial
- Proximity Sensors
- Proximity Sensors - Industrial
- Proximity/Occupancy Sensors Finished Units
- Sensor Cable Accessories
- Sensor Cable Assemblies
- Sensor Interface Junction Blocks
- Sensor, Transducer Accessories
- Sensor, Transducer Amplifiers
- Shock Sensors
- Solar Cells
- Specialized Sensors
- Strain Gauges
- Temperature Sensors
- Touch Sensors
- Ultrasonic Receivers, Transmitters
- Ultrasonic Receivers, Transmitters - Industrial
-
Switches
- Accessories
- Accessories - Boots, Seals
- Accessories - Caps
- Cable Pull Switches
- Configurable Switch Components - Body
- Configurable Switch Components - Contact Block
- Configurable Switch Components - Illumination Sour
- Configurable Switch Components - Lens
- DIP Switches
- Disconnect Switch Components
- Emergency Stop (E-Stop) Switches
- Interlock Switches
- Keylock Switches
- Keypad Switches
- Limit Switches
- Magnetic, Reed Switches
- Navigation Switches, Joystick
- Programmable Display Switches
- Pushbutton Switches
- Pushbutton Switches - Hall Effect
- Rocker Switches
- Rotary Switches
- Selector Switches
- Slide Switches
- Tactile Switches
- Thumbwheel Switches
- Toggle Switches
- Transformers
- View More >>
| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Technology | Current - Supply | Voltage - Input | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Standards | Current - Output / Channel | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Load Type | Rds On (Typ) | Current - Peak Output | Voltage - Load | Voltage - Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
NXP USA Inc. MC7457VG1000NC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 483-BCBGA, FCCBGA | 483-FCCBGA (29x29) | ROHS3 Compliant | 1 (Unlimited) | REACH info available upon request | 2832-MC7457VG1000NC | 3A991A1 | 8542.31.0000 | 36 | PowerPC G4 | 1GHz | 1 Core, 32-Bit | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | - | - | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. NE57810TK/1Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | 0°C ~ 70°C (TA) | Converter, DDR SDRAM | Surface Mount | 10-VDFN Exposed Pad | 1.6V ~ 3.6V | 10-HVSON (10x10) | REACH Unaffected | OBSOLETE | 1 | 1 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MPC860PCZQ50D4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 95°C (TJ) | Surface Mount | 357-BBGA | 357-PBGA (25x25) | RoHS non-compliant | 3 (168 Hours) | REACH info available upon request | 2832-MPC860PCZQ50D4 | 3A991A2 | 8542.31.0000 | 5 | MPC860 | 50MHz | 1 Core, 32-Bit | Communications; CPM | DRAM | No | - | 10Mbps (4), 10/100Mbps (1) | - | - | 3.3V | - | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC56F8013VFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8000 | Bulk | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC56F80 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC56F8013VFAE | 3A991A2 | 8542.31.0000 | 1 | 26 | 56800E | 16-Bit | 32MHz | I²C, LINbus, SCI, SPI | POR, PWM, WDT | 16KB (8K x 16) | FLASH | - | 2K x 16 | 3V ~ 3.6V | A/D 6x12b | Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. S912XDT512J1CAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12XD | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-S912XDT512J1CAG | 3A991A2 | 8542.31.0000 | 600 | 119 | HCS12X | 16-Bit | 80MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 20K x 8 | 2.35V ~ 2.75V | A/D 24x10b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC2214FBD144/01,5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC21xx | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | LPC2214 | 144-LQFP (20x20) | ROHS3 Compliant | 2 (1 Year) | REACH info available upon request | 2832-LPC2214FBD144/01,5 | 3A991A2 | 8542.31.0000 | 17 | 112 | ARM7® | 16/32-Bit | 60MHz | EBI/EMI, FIFO, I²C, Microwire, SPI, SSI, SSP, UART/USART | PWM, WDT | 256KB (256K x 8) | FLASH | - | 16K x 8 | 1.65V ~ 1.95V, 3V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC812M101JTB16X | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC81xM | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-XFDFN | LPC812 | 16-XSON (3.2x2.5) | ROHS3 Compliant | 1 (Unlimited) | REACH info available upon request | 2832-LPC812M101JTB16XTR | EAR99 | 8542.31.0000 | 88 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | - | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MKL16Z256VMP4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | KL16 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LFBGA | MKL16Z256 | 64-MAPBGA (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MKL16Z256VMP4 | 3A991A2 | 8542.31.0000 | 490 | 54 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, TSI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 1x16b SAR; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MK60DX256VLQ10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK60DX256 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MK60DX256VLQ10 | 3A991A2 | 8542.31.0000 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, SDHC, SPI, UART/USART, USB | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 2x16b SAR; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC9S12C64MFAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC9S12 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC9S12C64MFAE | EAR99 | 8542.31.0000 | 505 | 31 | HCS12 | 16-Bit | 25MHz | CANbus, EBI/EMI, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 2.35V ~ 2.75V | A/D 8x10b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC9S08RG32FGE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS08 | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC9S08RG32FGE | EAR99 | 8542.31.0000 | 160 | 39 | HCS08 | 8-Bit | 8MHz | SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | - | External, Internal | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SC18IM704PWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | 16-TSSOP (0.173", 4.40mm Width) | 4mA | 1.71V ~ 3.6V | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | Controller | - | I²C | UART | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5534JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5534 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 39 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5534JBD100K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC5534 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 66 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 23x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5536JBD100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC5536 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 23x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5536JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5536 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 39 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SE050F2HQ1/Z018HZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | Surface Mount | 20-XFQFN Exposed Pad | Plug and Trust Secure Element | Not Verified | 20-HX2QFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 568-SE050F2HQ1/Z018HZTR | 3,000 | |||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC33879BPEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | MC33879 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MC33879BPEKR2TR | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MIMX8MN6DVTJZDA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | 486-LFBGA (14x14) | REACH Unaffected | OBSOLETE | 1 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 1.5GHz, 750MHz | 5 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | MIPI-CSI, MIPI-DSI, LCD | GbE | - | USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 3.3V | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | AC'97, I²C, I²S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE13Z256VLF7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MKE13Z256 | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 1,250 | 42 | ARM® Cortex®-M0+ | 32-Bit | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE12Z128VLF7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MKE12Z128 | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 1,250 | 42 | ARM® Cortex®-M0+ | 32-Bit | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1061XVN5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 225-LFBGA | MIMXRT1061 | 225-MAPBGA (13x13) | download | ROHS3 Compliant | REACH Unaffected | 568-MIMXRT1061XVN5B | 800 | 149 | ARM® Cortex®-M7 | 32-Bit | 500MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 128KB (128K x 8) | ROM | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | Internal | |||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MGD3160AM535EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | General Purpose | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) | - | MGD3160 | IGBT | 4.75V ~ 40V | 32-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MGD3160AM535EK | 42 | 15A | PWM, SPI | Over Temperature, Short Circuit | Half Bridge | - | 500mOhm | - | 12V ~ 25V | |||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC54016JET180 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54016 | 180-TFBGA (12x12) | RoHS non-compliant | Not Applicable | Vendor Undefined | 2832-LPC54016JET180 | 3A991A2 | 8542.31.0000 | 64 | 145 | ARM® Cortex®-M4 | 32-Bit | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | ROMless | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC11E13FBD48/301 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | RoHS non-compliant | Not Applicable | Vendor Undefined | 2832-LPC11E13FBD48/301 | 3A991A2 | 8542.31.0000 | 97 | 40 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | 2K x 8 | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC54S016JET180 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54S016 | 180-TFBGA (12x12) | RoHS non-compliant | Not Applicable | Vendor Undefined | 2832-LPC54S016JET180 | 5A992C | 8542.31.0000 | 31 | 145 | ARM® Cortex®-M4 | 32-Bit | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | ROMless | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234CTN1VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | ROHS3 Compliant | REACH Unaffected | 568-FS32V234CTN1VUB | OBSOLETE | 1 | ARM® Cortex®-A53 | 1GHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234BJN2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V234BJN2VUB | 1 | ARM® Cortex®-A53 | 800MHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V232BMN2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V232BMN2VUB | 1 | ARM® Cortex®-A53 | 800MHz | 2 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234BMN2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V234BMN2VUB | 1 | ARM® Cortex®-A53 | 800MHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART |
