Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Voltage - Rated | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Frequency | Technology | Current - Supply | Output Type | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Max Output Power x Channels @ Load | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Current Rating (Amps) | Current - Test | Power - Output | Gain | Noise Figure | Voltage - Test |
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NXP USA Inc. SPC5744BBK1AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5744 | 176-LQFP (24x24) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360805557 | 5A992C | 8542.31.0001 | 200 | 129 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. TFA9892AUK/N1BZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 49-UFBGA, WLCSP | Class D | Depop, Short-Circuit and Thermal Protection | TFA9892 | 1-Channel (Mono) | 2.7V ~ 5.5V | 49-WLCSP (3.63x3.13) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 2,000 | 6.6W x 1 @ 8Ohm | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. TJA1044T/1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | TJA1044 | 4.75V ~ 5.25V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | CANbus | 1/1 | Half | 300 mV | 5Mbps | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. TJA1057T/1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | TJA1057 | 4.75V ~ 5.25V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | CANbus | 1/1 | Half | 300 mV | 5Mbps | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. AFT31150NR5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | 65 V | Surface Mount | OM-780-2 | AFT31150 | 2.7GHz ~ 3.1GHz | LDMOS | OM-780-2 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8541.29.0075 | 50 | 10µA | 100 mA | 150W | 17.2dB | - | 32 V | ||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. FS32K144MAT0CMHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | FS32K144 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362117518 | 5A992C | 8542.31.0001 | 1,500 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 64MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. FS32K144MFT0VLHT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | FS32K144 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361056557 | 5A992C | 8542.31.0001 | 800 | 58 | ARM® Cortex®-M4F | 32-Bit Single-Core | 64MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC1114FHN33/303Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC1100XL | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1114 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935295633518 | 3A991A2 | 8542.31.0001 | 4,000 | 28 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC11E37FBD48/501Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11E3x | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935299677518 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 12K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC1768FET100Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC17xx | Tray | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 100-TFBGA | LPC1768 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935291036000 | OBSOLETE | 0000.00.0000 | 260 | 70 | ARM® Cortex®-M3 | 32-Bit Single-Core | 100MHz | CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 2.4V ~ 3.6V | A/D 8x12b; D/A 1x10b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC4337JET256Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC43xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | LPC4337 | 256-LBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935298804518 | 3A991A2 | 8542.31.0001 | 1,000 | 164 | ARM® Cortex®-M4/M0 | 32-Bit Dual-Core | 204MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 16K x 8 | 136K x 8 | 2.2V ~ 3.6V | A/D 8x10b; D/A 1x10b | Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC845M301JHI33E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC84x | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | LPC845 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935336507551 | 3A991A2 | 8542.31.0001 | 490 | 29 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.8V ~ 3.6V | A/D 12x12b; D/A 1x10b | External, Internal | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS4500CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360432528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS4500NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360434557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS4501NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360514528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS4503NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360447557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6500NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 250 | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6501CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362499557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6501CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362499528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6501NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362502528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6502CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360709528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6503CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360594528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6510NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6510 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360605557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6511CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6511 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360607528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6512NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6512 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360614557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6512NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6512 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360614528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC35FS6513NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6513 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360438528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Q5EZK08AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 569-LFBGA | MCIMX6 | 569-MAPBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362212557 | 5A992C | 8542.31.0001 | 189 | ARM® Cortex®-A9 | 800MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6S1AVM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360721557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6X4AVM08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 529-LFBGA | MCIMX6 | 529-MAPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361023518 | 5A992C | 8542.31.0001 | 750 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD, LVDS | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC |
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