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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Voltage - Input | Output Type | Ratio - Input:Output | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Voltage - Output | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC33882PEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | - | MC33882 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI, Parallel | 6 | Current Limiting (Fixed), Open Load Detect, Over Voltage | Low Side | 400mOhm | 8V ~ 25V | General Purpose | - | |||||||||||||||||||||||||||||||
| NXP USA Inc. MC33907AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | Power Supply, Automotive Applications | Surface Mount | 48-LQFP Exposed Pad | MC339 | -1V ~ 40V | 48-HLQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315165528 | EAR99 | 8542.39.0001 | 2,000 | 6 | Multiple | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33908AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | Power Supply, Automotive Applications | Surface Mount | 48-LQFP Exposed Pad | MC339 | -1V ~ 40V | 48-HLQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324644528 | EAR99 | 8542.39.0001 | 2,000 | 6 | Multiple | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC50XS4200BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC50XS4200 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070502518 | EAR99 | 8542.39.0001 | 1,000 | 3.3V ~ 5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 50mOhm | 8V ~ 36V | General Purpose | 1.2A | ||||||||||||||||||||||||||||||
| NXP USA Inc. MC50XSD200BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC50XSD200 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070504518 | EAR99 | 8542.39.0001 | 1,000 | 3.3V ~ 5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 50mOhm | 8V ~ 36V | General Purpose | 1.2A | ||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08LL64CLKR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 80-LQFP | MC9S08 | 80-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322941528 | 3A991A2 | 8542.31.0001 | 1,000 | 39 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LCD, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX283DVM4BR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tape & Reel (TR) | Active | -20°C ~ 70°C (TA) | Surface Mount | 289-LFBGA | MCIMX283 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 1,000 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keyboard, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | |||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0100NPAZESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | 12 | Multiple | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F3AEPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312083528 | EAR99 | 8542.39.0001 | 4,000 | 11 | Multiple | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200NPANESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | 11 | Multiple | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XEP100BCAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325871528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5674FF3MVY3R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 516-BBGA | SPC5674 | 516-PBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314555518 | 3A991A2 | 8542.31.0001 | 500 | 32 | e200z7 | 32-Bit Single-Core | 264MHz | CANbus, EBI/EMI, SCI, SPI | DMA, POR, PWM | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08V ~ 5.25V | A/D 64x12b | External | ||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F0ANES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Converter, i.MX6 | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN128VLH10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FN128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 24K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN128VLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MK22FN128 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324748557 | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 24K x 8 | 1.71V ~ 3.6V | A/D 33x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN128VMP10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LFBGA | MK22FN128 | 64-MAPBGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325864557 | 3A991A2 | 8542.31.0001 | 640 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 24K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MK22FN512VDC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK22FN512 | 121-XFBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 348 | 81 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MK50DX256CMD10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LBGA | MK50DX256 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315017557 | 3A991A2 | 8542.31.0001 | 160 | 96 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 4K x 8 | 64K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MKL03Z16VFG4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | MKL03Z16 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317978557 | 3A991A2 | 8542.31.0001 | 490 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | ||||||||||||||||||||||||||||||
| NXP USA Inc. MKL03Z8VFG4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | MKL03Z8 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MK50DX128CLH7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MK50DX128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 35 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MKL03Z32CAF4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-UFBGA, WLCSP | MKL03Z32 | 20-WLCSP (2x1.61) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 5,000 | 18 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MC33908AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C | Power Supply, Automotive Applications | Surface Mount | 48-LQFP Exposed Pad | MC339 | -1V ~ 40V | 48-HLQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324644557 | EAR99 | 8542.39.0001 | 1,250 | 6 | Multiple | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912XEP100BCAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVFP64F1CLQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 100 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVFP64F1VLQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321914557 | 3A991A2 | 8542.31.0001 | 300 | 100 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVH128F2CLQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 100 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVH64F2CLQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322021557 | 3A991A2 | 8542.31.0001 | 300 | 100 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVHY64F1VLQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317768557 | 3A991A2 | 8542.31.0001 | 300 | 100 | S12Z | 16-Bit | 32MHz | CANbus, I²C, LINbus, SCI, SPI | DMA, LCD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVMC12F1WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316283557 | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal |
