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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Current - Supply | Termination Style | Output Type | Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Power (Watts) | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Output Isolation | Internal Switch(s) | Voltage - Breakdown | Topology | Voltage - Start Up | Duty Cycle | Frequency - Switching | Fault Protection | Control Features | Accuracy | Port Size | Pressure Type | Operating Pressure | Port Style | Maximum Pressure |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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NXP USA Inc. TEA19031AGT/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -25°C ~ 125°C (TJ) | Surface Mount | 10-SOIC (0.154", 3.90mm Width) | TEA19031 | 10-SO | download | 1 (Unlimited) | REACH Unaffected | 935351597118 | EAR99 | 8542.39.0001 | 2,500 | 0V ~ 21V | 45 W | Isolated | Yes | - | - | - | 10MHz | Current Limiting, Over Load, Over Temperature, Over Voltage | EN | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TEA1938T/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | GreenChip™ | Tape & Reel (TR) | Obsolete | -25°C ~ 125°C (TJ) | Surface Mount | 10-SOIC (0.154", 3.90mm Width) | TEA1938 | 10-SO | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935351814118 | EAR99 | 8542.39.0001 | 2,500 | 0V ~ 120V | Isolated | No | - | Flyback | 17.5 V | - | 25.5kHz ~ 128kHz | Over Power, Over Temperature, Over Voltage | EN, Soft Start | ||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FXPS7140D4T1 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | - | Board Mount | - | - | FXPS71 | - | - | - | - | - | ROHS3 Compliant | REACH Unaffected | 935339691564 | OBSOLETE | 0000.00.0000 | 2,000 | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6L3DVN10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6L3EVN10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360496557 | 5A992C | 8542.31.0001 | 160 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6L8DVN10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935352982518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S5DVM10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360456518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S6AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | REACH Unaffected | 935352997518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U1AVM08AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360458557 | 5A002A1 | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U1AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360458518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U5DVM10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U6AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360347518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MCIMX6X1CVO08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361033557 | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC844M201JHI33E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC84x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | LPC844 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935336503551 | 3A991A2 | 8542.31.0001 | 490 | 29 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 30MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 12x12b | External, Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4500NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360434528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4501CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360512557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4501CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360512528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4501NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360514557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4502CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360441557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4502CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360441528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4502NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360443557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4502NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360443528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4503NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360447528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6500NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360707528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6501NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6501 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362502557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6502CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360709557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6502NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360592557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6502NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360592528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6503CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360594557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6503NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360596557 | EAR99 | 8542.39.0001 | 250 |
