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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Current - Supply | Battery Chemistry | Number of Cells | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Fault Protection |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. FS32K148UAT0VLQR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | FS32K148 | 144-LQFP (20x20) | download | ROHS3 Compliant | REACH Unaffected | 935368559528 | 5A992C | 8542.31.0001 | 500 | 128 | ARM® Cortex®-M4F | 32-Bit Single-Core | 112MHz | CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART | I²S, POR, PWM, WDT | 2MB (2M x 8) | FLASH | 4K x 8 | 256K x 8 | 2.7V ~ 5.5V | A/D 32x12b SAR; D/A 1x8b | Internal | |||||||||||||
| NXP USA Inc. FS32K148URT0VLQR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | FS32K148 | 144-LQFP (20x20) | download | ROHS3 Compliant | REACH Unaffected | 935369393528 | 5A992C | 8542.31.0001 | 500 | 128 | ARM® Cortex®-M4F | 32-Bit Single-Core | 112MHz | CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART | I²S, POR, PWM, WDT | 2MB (2M x 8) | FLASH | 4K x 8 | 256K x 8 | 2.7V ~ 5.5V | A/D 32x12b SAR; D/A 1x8b | Internal | |||||||||||||
| NXP USA Inc. LPC51U68JBD48E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC51U | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | LPC51U68 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 37 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 100MHz | Flexcomm, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.62V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||
| NXP USA Inc. LPC51U68JBD64QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC51U | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | LPC51U68 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 48 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 100MHz | Flexcomm, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 96K x 8 | 1.62V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||
| NXP USA Inc. MC32PF1550A5EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370633557 | EAR99 | 8542.39.0001 | 2,450 | |||||||||||||||||||||||
| NXP USA Inc. MC32PF1550A5EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370633528 | EAR99 | 8542.39.0001 | 5,000 | |||||||||||||||||||||||
| NXP USA Inc. MC32PF1550A7EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370637528 | EAR99 | 8542.39.0001 | 5,000 | |||||||||||||||||||||||
| NXP USA Inc. MC908AS60ACFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC908 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323984528 | EAR99 | 8542.31.0001 | 750 | 52 | HC08 | 8-Bit | 8.4MHz | CANbus, SCI, SPI | LVD, POR, PWM | 60KB (60K x 8) | FLASH | 1K x 8 | 2K x 8 | 4.5V ~ 5.5V | A/D 15x8b | Internal | |||||||||||||
| NXP USA Inc. MKL17Z64VLH4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKL17Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315255528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, FlexIO, SPI, UART/USART | DMA, I²S, PWM, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 20x16b | Internal | ||||||||||||
| NXP USA Inc. MC33771BSA1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935349742557 | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33771BTA1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | SPI | Over/Under Voltage | |||||||||||||||||||||
| NXP USA Inc. MC33771BTA1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935350632528 | EAR99 | 8542.39.0001 | 1,500 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33771BTA2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935350619557 | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33771BTB1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935350626557 | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33772BTP1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935359123528 | EAR99 | 8542.39.0001 | 2,000 | Battery Cell Controller | TPL | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33772BSA1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358981528 | EAR99 | 8542.39.0001 | 2,000 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33772BTA1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935359127557 | EAR99 | 8542.39.0001 | 250 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33772BSP2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358987557 | EAR99 | 8542.39.0001 | 250 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33772BTP2AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935359125528 | EAR99 | 8542.39.0001 | 2,000 | Battery Cell Controller | TPL | Over/Under Voltage | ||||||||||||||||||||
| NXP USA Inc. MC33771BSP1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | SPI | Over/Under Voltage | |||||||||||||||||||||
| NXP USA Inc. MC33772BSP1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 250 | Battery Cell Controller | SPI | Over/Under Voltage | |||||||||||||||||||||
| NXP USA Inc. MC33772BTC0AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 250 | Battery Cell Controller | SPI | Over/Under Voltage | |||||||||||||||||||||
| NXP USA Inc. MC33PF8100EPES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.7V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935384542557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||
| NXP USA Inc. MC33PF8100ERES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.7V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935384516557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||
| NXP USA Inc. MC34PF8100EPEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.7V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||
| NXP USA Inc. MC34PF8100EQEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.7V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||
| NXP USA Inc. MC34PF8100EREP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.7V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||
| NXP USA Inc. MC32PF8121F1EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Industrial, IoT | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC32PF8121 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935385549557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||
| NXP USA Inc. LPC54018J4MET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC540xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54018 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 189 | 137 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||
| NXP USA Inc. LPC54S018J4MET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC540xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54S018 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 189 | 137 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal |
