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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Current - Supply | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Standards | Control Interface | Configuration | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Display Type | Digits or Characters | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. PCF8576DU/2DA/2,02 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Surface Mount | Die | PCF8576 | 8 µA | 1.8V ~ 5.5V | Die | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8542.39.0001 | 8,640 | 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix | I²C | LCD | 10 Characters, 20 Characters, 160 Elements | ||||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. SL3S1003FUD/BG,003 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Active | SL3S1003 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8542.39.0001 | 96,000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11U34FHN33/311, | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC11 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 26 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 40KB (40K x 8) | FLASH | 4K x 8 | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11U35FBD48/401, | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 40 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11U36FBD48/401, | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 40 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11U36FBD64/401, | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 54 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC11U37FBD48/401, | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Discontinued at Digi-Key | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 40 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1317FBD48,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC13xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC1317 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 40 | ARM® Cortex®-M3 | 32-Bit Single-Core | 72MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 10K x 8 | 2V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1317FBD64,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC13xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC1317 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 51 | ARM® Cortex®-M3 | 32-Bit Single-Core | 72MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 10K x 8 | 2V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1347FBD64,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC13xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC1347 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 51 | ARM® Cortex®-M3 | 32-Bit Single-Core | 72MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 12K x 8 | 2V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1316FHN33,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC13xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1316 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 26 | ARM® Cortex®-M3 | 32-Bit Single-Core | 72MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 48KB (48K x 8) | FLASH | 4K x 8 | 8K x 8 | 2V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1317FHN33,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC13xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VQFN Exposed Pad | LPC1317 | 32-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 26 | ARM® Cortex®-M3 | 32-Bit Single-Core | 72MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 10K x 8 | 2V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK51DN512ZCLL10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | MK51DN512 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321739557 | 3A991A2 | 8542.31.0001 | 90 | 59 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 35x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK51DN512ZCMC10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K50 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 121-LFBGA | MK51DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319917557 | 3A991A2 | 8542.31.0001 | 348 | 78 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 37x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PA60VLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MC9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325674557 | 3A991A2 | 8542.31.0001 | 160 | 57 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. P1013NXN2LFB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P1 | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 689-BBGA Exposed Pad | P1013 | 689-TEPBGA II (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325532557 | 3A991A2 | 8542.31.0001 | 27 | PowerPC e500v2 | 1.067GHz | 1 Core, 32-Bit | - | DDR2, DDR3 | No | LCD | 10/100/1000Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | - | DUART, I²C, I²S, MMC/SD, SPI | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK20DN512ZVLK10 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tray | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK20DN512 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 480 | 52 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 27x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33660EF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | Automotive | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC336 | 8V ~ 18V | 8-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312402574 | EAR99 | 8542.39.0001 | 98 | Serial Link Bus Interface | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC13892CJVL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 85°C | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | Surface Mount | 186-LFBGA | MC13892 | - | - | 186-PBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317536557 | EAR99 | 8542.39.0001 | 945 | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PCF8537AH/1,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 80°C | Surface Mount | 64-TQFP | PCF8537 | 90 µA | 1.8V ~ 5.5V | 64-TQFP (10x10) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,500 | 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix | I²C | LCD | 22 Characters, 44 Characters, 352 Elements | ||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PTN3381DBS,518 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | Consumer Video | Surface Mount | 48-VFQFN Exposed Pad | PTN33 | 3.0V ~ 3.6V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | Shifter | DVI v1.0, HDMI v1.3a | I²C | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC16XSD200FKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TJ) | Surface Mount | 23-PowerQFN | Internal PWM, Slew Rate Controlled, Watchdog Timer | MC16XSD200 | - | N-Channel | 1:1 | 23-PQFN (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070599578 | EAR99 | 8542.39.0001 | 1,200 | 3V ~ 5.5V | SPI | 2 | Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage | High Side | 16mOhm (Max) | 8V ~ 36V | General Purpose | 3A | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34904C5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MC34904 | 2mA | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317943518 | EAR99 | 8542.39.0001 | 1,000 | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34905CS3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MC34905 | 2mA | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321983518 | EAR99 | 8542.39.0001 | 1,000 | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34905CS5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MC34905 | 2mA | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315202518 | EAR99 | 8542.39.0001 | 1,000 | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6D5EYM10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tape & Reel (TR) | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315182518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6D6AVT08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311627518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6Q4AVT08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317979518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6Q5EYM10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6Q6AVT10ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313319518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
