Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Technology | Current - Supply | Voltage - Input | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Configuration | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Display Type | Digits or Characters | Rds On (Typ) | Voltage - Load | Voltage - Output | Switch Type | Current - Output (Max) | FET Type | Drain to Source Voltage (Vdss) | Current - Continuous Drain (Id) @ 25°C | Drive Voltage (Max Rds On, Min Rds On) | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Gate Charge (Qg) (Max) @ Vgs | Vgs (Max) | Input Capacitance (Ciss) (Max) @ Vds | FET Feature | Power Dissipation (Max) |
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NXP USA Inc. MK64FN1M0VLQ12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK64FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324728557 | 3A991A2 | 8542.31.0001 | 60 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MK64FN1M0VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK64FN1M0 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315206557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MK64FX512VMD12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LBGA | MK64FX512 | 144-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324731557 | 3A991A2 | 8542.31.0001 | 160 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 192K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z32VLC2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z32 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315854557 | 3A991A2 | 8542.31.0001 | 250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z32VQH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-QFP | MKE02Z32 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 84 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE02Z64VLH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE02Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE04Z8VWJ4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tube | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MKE04Z8 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317919574 | 3A991A2 | 8542.31.0001 | 38 | 18 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKM14Z64CHH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 44-VFLGA Exposed Pad | MKM14Z64 | 44-MAPLGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324716557 | 3A991A2 | 8542.31.0001 | 2,450 | 20 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 5x16b, 4x24b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MMPF0100F0AEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317731557 | EAR99 | 8542.39.0001 | 260 | 12 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MMPF0200NPAEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311454557 | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. P2010NSN2NHC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | 0°C ~ 125°C (TA) | Surface Mount | 689-BBGA Exposed Pad | P2010 | 689-TEPBGA II (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321966557 | 3A991A2 | 8542.31.0001 | 135 | PowerPC e500v2 | 1.2GHz | 1 Core, 32-Bit | - | DDR2, DDR3 | No | - | 10/100/1000Mbps (3) | - | USB 2.0 + PHY (2) | - | - | DUART, I²C, MMC/SD, SPI | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. P2020NSE2NHC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | 0°C ~ 125°C (TA) | Surface Mount | 689-BBGA Exposed Pad | P2020 | 689-TEPBGA II (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325867557 | OBSOLETE | 0000.00.0000 | 27 | PowerPC e500v2 | 1.2GHz | 2 Core, 32-Bit | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000Mbps (3) | - | USB 2.0 + PHY (2) | - | Cryptography, Random Number Generator | DUART, I²C, MMC/SD, SPI | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. P2040NXE7MMC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 780-BFBGA | P2040 | 780-FCPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320185557 | 5A002A1 FRE | 8542.31.0001 | 60 | PowerPC e500mc | 1.2GHz | 4 Core, 32-Bit | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000Mbps (5) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | DUART, I²C, MMC/SD, RapidIO, SPI | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. P2041NSE7NNC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 780-BBGA, FCBGA | P2041 | 780-FCPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323481557 | 5A002A1 FRE | 8542.31.0001 | 60 | PowerPC e500mc | 1.3GHz | 4 Core, 32-Bit | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000Mbps (5), 10Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | DUART, I²C, MMC/SD, RapidIO, SPI | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. P2041NXN7NNC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 780-BFBGA | P2041 | 780-FCPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325809557 | 5A002A1 FRE | 8542.31.0001 | 60 | PowerPC e500mc | 1.3GHz | 4 Core, 32-Bit | - | DDR3, DDR3L | No | - | 10/100/1000Mbps (5), 10Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V | - | DUART, I²C, MMC/SD, RapidIO, SPI | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. P3041NXE7PNC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P3 | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 1295-BBGA, FCBGA | P3041NXE7 | 1295-FCPBGA (37.5x37.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321985557 | 5A002A1 FRE | 8542.31.0001 | 21 | PowerPC e500mc | 1.5GHz | 4 Core, 32-Bit | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000Mbps (5), 10Gbps (1) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | 1.5V, 1.8V, 2.5V, 3.3V | Boot Security, Cryptography, Random Number Generator, Secure Fusebox | DUART, I²C, MMC/SD, RapidIO, SPI | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S08AW16AE0VFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | S9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318571557 | 3A991A2 | 8542.31.0001 | 1,300 | 38 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S08DZ16F2VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314798557 | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S12GN32F0CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323289557 | 3A991A2 | 8542.31.0001 | 1,300 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S12P128J0VFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315565557 | 3A991A2 | 8542.31.0001 | 1,300 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S12P96J0CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,300 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S12P96J0CFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC34903CP5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MC34903 | 2mA | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311548574 | EAR99 | 8542.39.0001 | 42 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC34905CS5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MC34905 | 2mA | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315202574 | EAR99 | 8542.39.0001 | 42 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC11U37HFBD64/4QL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Uxx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | LPC11 | 64-LQFP (10x10) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 54 | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. NX5P2924BUKZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | NX5 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 6-XFBGA, WLCSP | Load Discharge, Slew Rate Controlled | NX5P2924 | Non-Inverting | N-Channel | 1:1 | 6-WLCSP (0.87x1.37) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | Not Required | On/Off | 1 | - | High Side | 14mOhm | 0.8V ~ 5.5V | General Purpose | 2.5A | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. NX5P2924UKZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | NX5 | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 6-UFBGA, WLCSP | Load Discharge, Slew Rate Controlled | NX5P2924 | Non-Inverting | N-Channel | 1:1 | 6-WLCSP (0.87x1.37) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | Not Required | On/Off | 1 | - | High Side | 14mOhm | 0.8V ~ 5.5V | General Purpose | 2.5A | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. PCA85262ATT/AJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | PCA85262 | 6 µA | 1.8V ~ 5.5V | 48-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,000 | 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix | I²C | LCD | 8 Characters, 16 Characters, 128 Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC11E67JBD48E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC11Exx | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 36 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 20K x 8 | 2.4V ~ 3.6V | A/D 8x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. PSMN8R5-108ESQ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -55°C ~ 175°C (TJ) | Through Hole | TO-262-3 Long Leads, I²Pak, TO-262AA | PSMN8 | MOSFET (Metal Oxide) | I2PAK | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8541.29.0095 | 50 | N-Channel | 108 V | 100A (Tj) | 10V | 8.5mOhm @ 25A, 10V | 4V @ 1mA | 111 nC @ 10 V | ±20V | 5512 pF @ 50 V | - | 263W (Tc) |
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