Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Controller Series |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. MK70FX512VMJ15 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K70 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | MK70FX512 | 256-MAPPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317627557 | 3A991A2 | 8542.31.0001 | 90 | 128 | ARM® Cortex®-M4 | 32-Bit Single-Core | 150MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 128K x 8 | 1.71V ~ 3.6V | A/D 71x16b; D/A 2x12b | Internal | ||||||||||||||||||||
NXP USA Inc. MM912G634CV2AP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C | Automotive | Surface Mount | 48-LQFP | MM912 | Not Verified | 2.25V ~ 5.25V | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314402557 | 3A991A2 | 8542.31.0001 | 250 | 9 | S12 | FLASH (48kB) | 2K x 8 | LIN, SCI | HCS12 | ||||||||||||||||||||||||
NXP USA Inc. MM912JP812AMAF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C | Engine Control | Surface Mount | 100-LQFP Exposed Pad | MM912 | Not Verified | 4.7V ~ 36V | 100-LQFP-EP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319825557 | EAR99 | 8542.39.0001 | 90 | 8 | S12P | FLASH (128kB) | 6K x 8 | CAN, SCI, SPI | HCS12 | ||||||||||||||||||||||||
NXP USA Inc. MPC5517GAVMG80 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC55xx Qorivva | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-BGA | MPC5517 | 208-BGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322912557 | 3A991A2 | 8542.31.0001 | 450 | 144 | e200z1 | 32-Bit Single-Core | 80MHz | CANbus, EBI/EMI, I²C, SCI, SPI | DMA, POR, PWM, WDT | 1.5MB (1.5M x 8) | FLASH | - | 80K x 8 | 1.35V ~ 1.65V | A/D 40x12b | External | ||||||||||||||||||||
NXP USA Inc. MPC8543ECPXAQGD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC85xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC85 | 783-FCPBGA (29x29) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 36 | PowerPC e500 | 1.0GHz | 1 Core, 32-Bit | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | Cryptography, Random Number Generator | DUART, I²C, PCI, RapidIO | |||||||||||||||||||||
NXP USA Inc. MPC8543EVTANGD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC85xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC85 | 783-FCPBGA (29x29) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 36 | PowerPC e500 | 800MHz | 1 Core, 32-Bit | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | Cryptography, Random Number Generator | DUART, I²C, PCI, RapidIO | |||||||||||||||||||||
NXP USA Inc. MPC8545EVTATGD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC85xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC85 | 783-FCPBGA (29x29) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 FRE | 8542.31.0001 | 36 | PowerPC e500 | 1.2GHz | 1 Core, 32-Bit | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | Cryptography, Random Number Generator | DUART, I²C, PCI, RapidIO | |||||||||||||||||||||
NXP USA Inc. MPC8547EPXAQGD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC85xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 783-BBGA, FCBGA | MPC85 | 783-FCPBGA (29x29) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.31.0001 | 36 | PowerPC e500 | 1.0GHz | 1 Core, 32-Bit | Signal Processing; SPE, Security; SEC | DDR, DDR2, SDRAM | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | Cryptography, Random Number Generator | DUART, I²C, PCI, RapidIO | |||||||||||||||||||||
NXP USA Inc. MC9S08GT16ACFCER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | MC9S08 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321065528 | 3A991A2 | 8542.31.0001 | 5,000 | 24 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | ||||||||||||||||||||
NXP USA Inc. MCZ33903CD3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310912518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||||
NXP USA Inc. MCZ33903CP3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324525518 | EAR99 | 8542.39.0001 | 1,000 | CAN | |||||||||||||||||||||||||||||||
NXP USA Inc. MCZ33903CP5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315869518 | EAR99 | 8542.39.0001 | 1,000 | CAN | |||||||||||||||||||||||||||||||
NXP USA Inc. MCZ33903CS5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | ||||||||||||||||||||||||||||||||
NXP USA Inc. MCZ33904C3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310937518 | EAR99 | 8542.39.0001 | 1,000 | CAN | |||||||||||||||||||||||||||||||
NXP USA Inc. MCZ33904C5EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | CAN | ||||||||||||||||||||||||||||||||
NXP USA Inc. MCZ33905CS3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317568518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||||||||||||
NXP USA Inc. MK10DN512ZVMC10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK10DN512 | 121-MAPBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 8542.31.0001 | 2,000 | 90 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||||||||||||
NXP USA Inc. MK20DN512ZVLQ10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK20DN512 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321706528 | 3A991A2 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||
NXP USA Inc. MK60DN512ZVLQ10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK60DN512 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310931528 | 3A991A2 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | ||||||||||||||||||||
NXP USA Inc. MM908E624AYPEWR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C | Automotive Mirror Control | Surface Mount | 54-BSSOP (0.295", 7.50mm Width) | MM908E624 | Not Verified | 5.5V ~ 18V | 54-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312816518 | EAR99 | 8542.39.0001 | 1,000 | 16 | HC08 | FLASH (16kB) | 512 x 8 | SCI, SPI | 908E | ||||||||||||||||||||||||
NXP USA Inc. MM912G634CV2APR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 105°C | Automotive | Surface Mount | 48-LQFP | MM912 | Not Verified | 2.25V ~ 5.25V | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314402528 | 3A991A2 | 8542.31.0001 | 2,000 | 9 | S12 | FLASH (48kB) | 2K x 8 | LIN, SCI | HCS12 | ||||||||||||||||||||||||
NXP USA Inc. MM912IP812AMAFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | Engine Control | Surface Mount | 100-LQFP Exposed Pad | MM912 | Not Verified | 4.7V ~ 36V | 100-LQFP-EP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310883578 | EAR99 | 8542.39.0001 | 800 | 8 | S12P | FLASH (96KB) | 6K x 8 | CAN, SCI, SPI | HCS12 | ||||||||||||||||||||||||
NXP USA Inc. S912XEP100J5VAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317235528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||||||||||||||||||||
NXP USA Inc. S912XEP768J5MAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317899528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 768KB (768K x 8) | FLASH | 4K x 8 | 48K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | ||||||||||||||||||||
NXP USA Inc. S9S08SG8E2CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | S9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313927534 | 3A991A2 | 8542.31.0001 | 5,000 | 12 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||
NXP USA Inc. S9S12DG12F1VPVER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S9S12 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313792528 | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12 | 16-Bit | 25MHz | CANbus, I²C, SCI, SPI | PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35V ~ 5.25V | A/D 16x10b | Internal | |||||||||||||||||||||
NXP USA Inc. S9S12G48F0MLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311618528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||
NXP USA Inc. S9S12G64F0MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317823528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||
NXP USA Inc. S9S12P128J0MFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||||||||||||||||||||
NXP USA Inc. SPC5643LF0MLQ1R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC56xx Qorivva | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5643 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 500 | e200z4 | 32-Bit Dual-Core | 120MHz | CANbus, FlexRay, LINbus, SPI, UART/USART | DMA, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 3V ~ 5.5V | A/D 32x12b | Internal |
Please send RFQ , we will respond immediately.