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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Current - Supply | Voltage - Input | Output Type | Number of Circuits | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Logic Type | -3db Bandwidth | Number of Bits | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Switch Circuit | Multiplexer/Demultiplexer Circuit | On-State Resistance (Max) | Channel-to-Channel Matching (ΔRon) | Voltage - Supply, Single (V+) | Voltage - Supply, Dual (V±) | Switch Time (Ton, Toff) (Max) | Charge Injection | Channel Capacitance (CS(off), CD(off)) | Current - Leakage (IS(off)) (Max) | Crosstalk | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Supply Voltage | Output Isolation | Internal Switch(s) | Voltage - Breakdown | Topology | Voltage - Start Up | Duty Cycle | Frequency - Switching | Fault Protection | Control Features | Voltage - Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. LPC54607J256BD208E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 208-LQFP | LPC54607 | 208-LQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 36 | 171 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 136K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC54607J256ET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54607 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 189 | 145 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 136K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. 74LVT1403DR,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 74LVT | Tray | Obsolete | -40°C ~ 85°C | Surface Mount | 32-TSSOP (0.240", 6.10mm Width) | 74LVT1403 | 32-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 44 | Driver/Receiver | 12 | 2.7V ~ 3.6V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVMC12F1MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317949528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVMC12F2WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323729557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVMC64F1MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVMC64F1VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318547557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVML12F1WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318052528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVML32F1MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323865557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVML64F1MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312248528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVML64F1WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320389528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVML64F2VKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313143557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVML64F2WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320695557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC8640HJ1067NE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640HJ1067 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343658557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.067GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC8640THJ1067NE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640THJ1067 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343661557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.067GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC8640VJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640VJ1250 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315503557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PS32K144UAT0VLLA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | PS32 | 100-LQFP (14x14) | download | 3 (168 Hours) | REACH Unaffected | 568-13381 | 5A992C | 8542.31.0001 | 1 | ARM® Cortex®-M4F | 32-Bit Single-Core | 112MHz | CANbus, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. PTN5110THQZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | USB | Surface Mount | 16-XFQFN Exposed Pad | PTN5110 | - | 16-HX2QFN (2.6x2.6) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | I²C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TEA19361T/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | GreenChip™ | Tape & Reel (TR) | Active | -25°C ~ 125°C (TJ) | Surface Mount | 10-SOIC (0.154", 3.90mm Width) | TEA19361 | 10-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | 0V ~ 120V | Isolated | No | - | Flyback | 14.9 V | - | 25.5kHz ~ 128kHz | Over Power, Over Temperature, Over Voltage | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33AR6000BGT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive Alternator, 3-Phase | Through Hole | TO-220-5 | MC33AR6000 | 5V ~ 16.5V | TO-220-5 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935320883174 | EAR99 | 8542.39.0001 | 1,000 | 1 | 10.6V ~ 16V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5746BSK1AMMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5746 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361027557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5747CSK0AMKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5747 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362157557 | 5A992C | 8542.31.0001 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TFA9891UK/N1AZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 49-UFBGA, WLCSP | Class D | Depop, Short-Circuit and Thermal Protection | TFA9891 | 1-Channel (Mono) | 2.7V ~ 5.5V | 49-WLCSP (3.43x2.98) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,000 | 3.6W x 1 @ 8Ohm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. CBTV24DD12AETY | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -10°C ~ 85°C (TA) | Surface Mount | 48-TFBGA | CBTV24 | 12 | 48-TFBGA (3x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354885518 | EAR99 | 8542.39.0001 | 4,500 | 7.4GHz | SPDT | 2:1 | 9Ohm | 400mOhm (Typ) | 1.62V ~ 3.63V | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. FS32K144MAT0CMHT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LFBGA | FS32K144 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935362117557 | 5A992C | 8542.31.0001 | 880 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 64MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. FS32K144MFT0VLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | FS32K144 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361056528 | 5A992C | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M4F | 32-Bit Single-Core | 64MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC1763FBD100Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC17xx | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | LPC1763 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935291276518 | 3A991A2 | 8542.31.0001 | 1,000 | 70 | ARM® Cortex®-M3 | 32-Bit Single-Core | 100MHz | I²C, IrDA, Microwire, SPI, SSI, UART/USART | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 64K x 8 | 2.4V ~ 3.6V | A/D 8x12b; D/A 1x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC2926FBD144,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC2900 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | LPC2926 | 144-LQFP (20x20) | download | ROHS3 Compliant | 2 (1 Year) | REACH Unaffected | 935293568551 | 3A991A2 | 8542.31.0001 | 60 | 104 | ARM9® | 16/32-Bit | 125MHz | CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB | DMA, POR, PWM, WDT | 256KB (256K x 8) | FLASH | 16K x 8 | 56K x 8 | 1.71V ~ 3.6V | A/D 24x10b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC802M001JHI33Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC80xM | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | LPC802 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935345948518 | EAR99 | 8542.31.0001 | 6,000 | 17 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 15MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS4500CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS4500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360432557 | EAR99 | 8542.39.0001 | 250 |
