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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Current - Supply | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC35FS6510CAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6510 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360598557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6510NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6510 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360605528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6511NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6511 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360609528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC35FS6512CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC35FS6512 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360612528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6L2EVN10ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SL | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 432-TFBGA | MCIMX6 | 432-MAPBGA (13x13) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360494518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A9 | 1.0GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100Mbps (1) | - | USB 2.0 + PHY (3) | 1.2V, 1.8V, 3.0V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | AC97, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6S6AVM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6S | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360726557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1GHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U4AVM08ADR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935360459518 | 5A002A1 | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||
 |
NXP USA Inc. MCIMX6X1AVO08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935353852518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||||||||||||
|
NXP USA Inc. MCIMX6X1CVO08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361033518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 200MHz, 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||||||||||||
| NXP USA Inc. S912ZVL64F0MFMR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | S912 | 32-QFN-EP (5x5) | download | ROHS3 Compliant | REACH Unaffected | 935360929578 | 3A991A2 | 8542.31.0001 | 2,500 | 19 | S12Z | 16-Bit | 32MHz | CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. S9S12G128ACLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935354392528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. S9S12G128ACLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361231528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. S9S12G128AVLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361323557 | 3A991A2 | 8542.31.0001 | 250 | 40 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. S9S12G128AVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361233557 | 3A991A2 | 8542.31.0001 | 160 | 54 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||
| NXP USA Inc. S9S12G96ACLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | S9S12 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361228557 | 3A991A2 | 8542.31.0001 | 450 | 86 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 3K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. S9S12G96AMLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | S9S12 | 100-LQFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935361229557 | 3A991A2 | 8542.31.0001 | 450 | 86 | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 3K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. MCIMX7D2DVM12SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7D | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 541-LFBGA | MCIMX7 | 541-MAPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.2GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | |||||||||||||||||||||||||
| NXP USA Inc. MCIMX7D7DVM10SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7D | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 541-LFBGA | MCIMX7 | 541-MAPBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935351921557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | |||||||||||||||||||||||||
| NXP USA Inc. TJA1028T/5V0/20/DZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | TJA1028 | 4.9V ~ 5.1V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935306845431 | EAR99 | 8542.39.0001 | 2,500 | LINbus | 1/1 | Half | 200 mV | - | ||||||||||||||||||||||||||||||
| NXP USA Inc. LPC54606J512ET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC54606 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 260 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. LPC54628J512ET180E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54628 | 180-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 189 | 145 | ARM® Cortex®-M4 | 32-Bit Single-Core | 220MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. LPC54606J512BD100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC54606 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. LPC54616J512BD100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC546xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC54616 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 16K x 8 | 200K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||||||||
| NXP USA Inc. MCIMX6Q6AVT10AER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6Q | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357621518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 1.0GHz | 4 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP4AVT8ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357858518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP6AVT8ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935357862518 | 5A992C | 8542.31.0001 | 500 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP4AVT1AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||
| NXP USA Inc. MCIMX6DP6AVT8AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DP | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-FBGA, FCBGA | MCIMX6 | 624-FCBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 852MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3L, DDR3 | Yes | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||
| NXP USA Inc. PS32V234CMN1AVUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 621-FBGA, FCBGA | PS32V234 | 621-FCPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 50 | ARM® Cortex®-A53, ARM® Cortex®-M4 | 1.0GHz, 133MHz | 4 Core, 64-Bit/1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | Yes | APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU | 1Gbps | - | - | 1.0V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | ||||||||||||||||||||||||||
| NXP USA Inc. FS32K144MFT0CLLT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | FS32K144 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 450 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 64MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 64K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR; D/A1x8b | Internal |
