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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Current - Supply | Output Type | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Standards | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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NXP USA Inc. TDF8548TH/N1,118 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | - | Surface Mount | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad | Class AB | Depop, Short-Circuit and Thermal Protection | TDF854 | 4-Channel (Quad) | 6V ~ 18V | 36-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935294642118 | OBSOLETE | 0000.00.0000 | 500 | 28W x 4 @ 4Ohm | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAF7730HV/N331D,55 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP Exposed Pad | Car Signal Processor | SAF7730 | 144-HLQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 300 | - | - | 400MHz | - | - | - | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. NX1A4WPZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Wireless Power Receiver | Surface Mount | 42-UFBGA, WLCSP | NX1 | 12mA | 6.1V ~ 18V | 42-WLCSP (3.56x3.41) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935302199012 | OBSOLETE | 0000.00.0000 | 2,000 | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5744PK1MLQ8 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5744 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323582557 | OBSOLETE | 0000.00.0000 | 300 | 79 | e200z4 | 32-Bit Dual-Core | 180MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MC32PF1510A2EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371713528 | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC32PF1510A5EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC32PF1510 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371785557 | EAR99 | 8542.39.0001 | 490 | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1550A6EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371936557 | EAR99 | 8542.39.0001 | 490 | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF1550A7EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | Surface Mount | 40-VFQFN Exposed Pad | MC34PF1550 | - | 3.8V ~ 7V | 40-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935371934528 | EAR99 | 8542.39.0001 | 5,000 | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1062CVL5A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Discontinued at Digi-Key | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1062 | 196-LFBGA (10x10) | download | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1052CVJ5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1050 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1052 | 196-LFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 189 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 512K x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX280DVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -20°C ~ 70°C (TA) | Surface Mount | 289-LFBGA | MCIMX280 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369765557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | ||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX283CVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX283 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369789557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | ||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX283DVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -20°C ~ 70°C (TA) | Surface Mount | 289-LFBGA | MCIMX283 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369797557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keyboard, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | ||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX287CVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX287 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369802557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad, LCD, Touchscreen | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | ||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8201A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8 Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8201 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC32PF8121A0EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Industrial, IoT | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC32PF8121 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8100CFES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935375839557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF8100CCEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF8100CHEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935383913557 | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200CLES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200CXES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382504557 | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08QL4CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. TFA9891UK/N1/S1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | Surface Mount | 49-UFBGA, WLCSP | Class D | Depop, Short-Circuit and Thermal Protection | TFA989 | 1-Channel (Mono) | 2.7V ~ 5.5V | 49-WLCSP (3.43x2.98) | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,000 | 3.6W x 1 @ 8Ohm | |||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TEA19051BABTK/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -20°C ~ 105°C (TJ) | 16-VDFN Exposed Pad | TEA19051 | 3mA | 2.9V ~ 21V | 16-HVSON (3.5x5.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | Controller | USB 2.0, USB 3.0 | USB | USB | ||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TEA19051BACTK/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -20°C ~ 105°C (TJ) | 16-VDFN Exposed Pad | TEA19051 | 3mA | 2.9V ~ 21V | 16-HVSON (3.5x5.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | Controller | USB 2.0, USB 3.0 | USB | USB | ||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TEA19051BAFTK/1J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -20°C ~ 105°C (TJ) | 16-VDFN Exposed Pad | TEA19051 | 3mA | 2.9V ~ 21V | 16-HVSON (3.5x5.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | Controller | USB 2.0, USB 3.0 | USB | USB | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5775BDK3MME2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BGA | SPC5775 | 416-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | 293 | e200z7 | 32-Bit Dual-Core | 220MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 40x12b eQADCx2 | External | |||||||||||||||||||||||||||||||
| NXP USA Inc. MC56F82623VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MC56F82 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 26 | 56800EX | 32-Bit Single-Core | 100MHz | SCI | DMA, LVD, POR, PWM, WDT | 32KB (16K x 16) | FLASH | - | 8K x 8 | 2.7V ~ 3.6V | A/D 6x12b | Internal | |||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6Z0DVM09AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 900MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | Keypad | - | - | USB 2.0 OTG + PHY (2) | - | A-HAB, ARM TZ, CSU, SJC, SNVS | eCSPI, ESAI, I²C, MMC/SD/SDIO, SAI, SPI, UART, USB |
