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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Frequency | Current - Supply | Battery Chemistry | Number of Cells | Output Type | Sensitivity | Digi-Key Programmable | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Data Rate (Max) | Number of Outputs | Memory Size | Fault Protection | Output Configuration | Serial Interfaces | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) | Power - Output | RF Family/Standard | Modulation | Current - Receiving | Current - Transmitting | Gain | P1dB | Noise Figure | RF Type | Test Frequency | GPIO |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. SPC5744BBK1AMMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5744 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935368921557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5744BSK1AMMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | SPC5744 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370336557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 1.5MB (1.5M x 8) | FLASH | 64K x 8 | 192K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5746BTK1AVMH6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LFBGA | SPC5746 | 100-MAPBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935370344557 | 5A992C | 8542.31.0001 | 880 | e200z4 | 32-Bit Single-Core | 160MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI | DMA, I²S, POR, WDT | 3MB (3M x 8) | FLASH | 64K x 8 | 384K x 8 | 3.15V ~ 5.5V | A/D 36x10b, 16x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5746CSK1AVKU6 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 176-LQFP Exposed Pad | SPC5746 | 176-LQFP (24x24) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935368557557 | 5A992C | 8542.31.0001 | 200 | 129 | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz, 160MHz | CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5777CDK3MME4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 416-BGA | SPC5777 | 416-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935368231518 | 5A992C | 8542.31.0001 | 500 | e200z7 | 32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 16b Sigma-Delta, eQADC | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5777CDK3MMO4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 516-BGA | SPC5777 | 516-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 200 | e200z7 | 32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 16b Sigma-Delta, eQADC | Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SPC5777CDK3MMO4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 516-BGA | SPC5777 | 516-MAPBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935368233518 | 5A992C | 8542.31.0001 | 500 | e200z7 | 32-Bit Tri-Core | 264MHz | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | DMA, LVD, POR, Zipwire | 8MB (8M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 16b Sigma-Delta, eQADC | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BTP1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935350893528 | EAR99 | 8542.39.0001 | 1,500 | Battery Cell Controller | TPL | Over/Under Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BSP2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935349658557 | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BSP2AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935349658528 | EAR99 | 8542.39.0001 | 1,500 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33772BSP1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358985528 | EAR99 | 8542.39.0001 | 2,000 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33772BSA1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 250 | Battery Cell Controller | SPI | Over/Under Voltage | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33772BTA1AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935359127528 | EAR99 | 8542.39.0001 | 2,000 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33772BTP2AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935359125557 | EAR99 | 8542.39.0001 | 250 | Battery Cell Controller | TPL | Over/Under Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33772BSA2AER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | MC33772 | Lithium Ion | 3 ~ 6 | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935358983528 | EAR99 | 8542.39.0001 | 2,000 | Battery Cell Controller | SPI | Over/Under Voltage | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33771BTP1AE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP Exposed Pad | MC33771 | Lithium Ion | 7 ~ 14 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 160 | Battery Cell Controller | TPL | Over/Under Voltage | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC17XSF500BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM | MC17XSF500 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070602518 | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 7mOhm, 17mOhm | 18V (Max) | General Purpose | 5.5A, 11A | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC07XSF517BEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM | MC07XSF517 | - | N-Channel | 1:1 | 54-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070519574 | EAR99 | 8542.39.0001 | 26 | 4.5V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 7mOhm, 17mOhm | 18V (Max) | General Purpose | 5.5A, 11A | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC17XSF500BEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM | MC17XSF500 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070602574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 7mOhm, 17mOhm | 18V (Max) | General Purpose | 5.5A, 11A | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. BGU8006Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | Surface Mount | 6-XFBGA, WLCSP | BGU80 | 1.559GHz ~ 1.61GHz | 8.4mA | 1.5V ~ 3.1V | 6-WLCSP (0.65x0.44) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934066741044 | OBSOLETE | 0000.00.0000 | 20,000 | 19dB | -11.2dBm | 0.9dB | Galileo, GLONASS, GPS | 1.575GHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1064DVL6A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1064 | Tray | Discontinued at Digi-Key | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1064 | 196-LFBGA (10x10) | download | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC54S016JET100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC540xx | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-TFBGA | LPC54S016 | 100-TFBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | 64 | ARM® Cortex®-M4 | 32-Bit Single-Core | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | ROMless | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. QN9080-001-M17Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 54-LFLGA | TxRx + MCU | QN9080 | 2.4GHz ~ 2.4835GHz | -92.7dBm | Not Verified | 1.67V ~ 3.6V | 54-LFLGA (9.7x6) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343646515 | 5A992C | 8542.39.0001 | 600 | Bluetooth v5.0 | 2Mbps | 512kB Flash, 128kB SRAM | ADC, GPIO, I²C, SPI, UART, USART, USB | 2dBm | Bluetooth | FSK | 4mA | 3.5mA | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM4DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM4 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM4CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM4 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378343557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM2CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM2 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 1 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM1DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM1 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 1 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX7U3DVK07SC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7ULP | Tray | Obsolete | 0°C ~ 95°C | MCIMX7 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | ARM® Cortex®-A7 | 720MHz | 1 Core, 32-Bit | ARM® Cortex®-M4 | LPDDR2, LPDDR3 | Yes | MIPI-DSI | - | - | USB 2.0 (2) | Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot | FlexIO, GPIO, I²C, I²S, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SE050B1HQ1/Z01SEZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | Industry 4.0 | Surface Mount | 20-XFQFN Exposed Pad | IoT Secure Element | SE050B1 | Not Verified | 20-HX2QFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 5A992C | 8542.39.0001 | 3,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. K32L2B11VMP0A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | K32 L2 | Tray | Active | - | Surface Mount | 64-LFBGA | K32L2 | 64-MAPBGA (5x5) | download | ROHS3 Compliant | REACH Unaffected | 3A991A2 | 8542.31.0001 | 640 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | FlexIO, I²C, SPI, TSI, UART/USART, USB | DMA, LCD, PWM, WDT | 64KB (64K x 8) | FLASH | - | 32K x 8 | 1.2V | - | Internal |
