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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Current - Supply | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
NXP USA Inc. LX2162RE82029B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ LX | Tray | Active | 5°C ~ 105°C (TA) | Surface Mount | 1150-FBGA | 1150-FBGA (23x23) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 60 | ARM® Cortex®-A72 | 2GHz | 16 Core, 64-Bit | - | DDR4, SDRAM | No | - | - | SATA 6Gbps (4) | USB 3.0 (1) | - | - | CANbus, I²C, PCIe, SPI, UART | ||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX536AVP8C2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX53 | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 529-FBGA | MCIMX536 | 529-FBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 84 | ARM® Cortex®-A8 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | DDR2, DDR3, LPDDR2 | Yes | Keypad, LCD | 10/100Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.3V, 1.8V, 2.775V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 1-Wire, AC'97, CAN, I²C, I²S, MMC/SD, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||
| NXP USA Inc. TJA1028TK/5V0/20AZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-VDFN Exposed Pad | Transceiver | 3.234V ~ 3.366V, 4.9V ~ 5.1V | 8-HVSON (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LIN | 1/1 | Half | 200 mV | 20kBaud | ||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1124CHG/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 24-VFQFN Exposed Pad | Transceiver | 5V ~ 28V | 24-DHVQFN (5.5x3.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | LIN | 4/4 | Full | 200 mV | 20kBaud | ||||||||||||||||||||||||||||||||
| NXP USA Inc. MVR5510AMMA4ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MVR5510 | 15mA | 2.7V ~ 60V | 56-HVQFN (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MVR5510AMDAHES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Automotive | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MVR5510 | 15mA | 2.7V ~ 60V | 56-HVQFN (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MVR5510AMBA0ESR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MVR5510 | 15mA | 2.7V ~ 60V | 56-HVQFN (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MVR5510AVMA0EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tray | Active | -40°C ~ 125°C (TA) | Automotive | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MVR5510 | 15mA | 2.7V ~ 60V | 56-HVQFN (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MVR5510AVMA0EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Automotive | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MVR5510 | 15mA | 2.7V ~ 60V | 56-HVQFN (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TJA1043ATK/0Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Cut Tape (CT) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 14-VDFN Exposed Pad | Transceiver | 4.5V ~ 5.5V | 14-HVSON (3x4.5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 6,000 | CANbus | 1/1 | Half | 120 mV | 5Mbps | ||||||||||||||||||||||||||||||||||
| NXP USA Inc. S32G274AABK0VUCT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 525-FBGA, FCBGA | 525-FCPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 420 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 400MHz, 1GHz | 4 Core, 64-Bit/3 Core, 32-Bit | - | DDR3L SDRAM, LPDDR4 DRAM | - | - | MII, RGMII, RMII, SGMII | - | USB OTG (1) | - | HSE-H | CAN, FlexRay, I²C, SPI, UART | ||||||||||||||||||||||||||
| NXP USA Inc. PIMXRT1064DVJ6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | PIMXRT1064 | ROHS3 Compliant | REACH Unaffected | 568-PIMXRT1064DVJ6B | 189 | |||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. PIMXRT1062DVL6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | PIMXRT1062 | ROHS3 Compliant | REACH Unaffected | 568-PIMXRT1062DVL6B | 240 | ||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. PIMXRT1062CVL5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | PIMXRT1062 | ROHS3 Compliant | REACH Unaffected | 568-PIMXRT1062CVL5B | 240 | ||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1064CVJ5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1064 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1064 | 196-LFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 189 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 4MB (4M x 8) | FLASH | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1061CVL5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1061 | 196-MAPBGA (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1062CVJ5BR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1062 | 196-LFBGA (12x12) | ROHS3 Compliant | REACH Unaffected | 1,000 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1061CVJ5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1061 | 196-LFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 189 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT106ADVL6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT106 | 196-MAPBGA (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | ||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MN5CVPIZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MN | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 306-TFBGA | MIMX8MN5 | 306-TFBGA (11x11) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 168 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 1.4GHz | 4 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | LCD, MIPI-CSI, MIPI-DSI | GbE | - | USB 2.0 OTG + PHY (1) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | AC'97, I²C, I²S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART | ||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1165DVM6A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MIMXRT1165 | 289-LFBGA (14x14) | download | ROHS3 Compliant | REACH Unaffected | 152 | ARM® Cortex®-M4/M7 | 32-Bit Dual-Core | 240MHz, 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | - | External Program Memory | - | 1M x 8 | 2.4V ~ 3.6V | A/D 2x12b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||
| NXP USA Inc. MCF54455VP266 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 360-BBGA | MCF54455 | 360-BGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 300 | 132 | Coldfire V4 | 32-Bit Single-Core | 266MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | External, Internal | |||||||||||||||||||||||||||
| NXP USA Inc. MCF54454CVP200 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 360-BBGA | MCF54454 | 360-BGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 300 | 132 | Coldfire V4 | 32-Bit Single-Core | 200MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | External, Internal | |||||||||||||||||||||||||||
| NXP USA Inc. MCF54452VP266R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tape & Reel (TR) | Active | 0°C ~ 70°C (TA) | Surface Mount | 360-BBGA | MCF54452 | 360-BGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 500 | 132 | Coldfire V4 | 32-Bit Single-Core | 266MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | External, Internal | |||||||||||||||||||||||||||
| NXP USA Inc. MCF54452VP266 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Active | 0°C ~ 70°C (TA) | Surface Mount | 360-BBGA | MCF54452 | 360-BGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 132 | Coldfire V4 | 32-Bit Single-Core | 266MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | External, Internal | |||||||||||||||||||||||||
| NXP USA Inc. MCF54453CVP200 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MCF5445x | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 360-BBGA | MCF54453 | 360-BGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 300 | 132 | Coldfire V4 | 32-Bit Single-Core | 200MHz | I²C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | External, Internal | |||||||||||||||||||||||||
| NXP USA Inc. MIMXRT105SDVL6B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT105 | 196-MAPBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 512K x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||||||||||||||||
|
NXP USA Inc. TDF8534BHH/N3Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 1,000 | ||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TDF8532BHH/N3Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 1,000 | ||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. TDF8532BHH/N3K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 90 |
