Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Current - Supply | Voltage - Input | Number of Channels | Output Type | Digi-Key Programmable | Input | Output | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Interrupt Output | Current - Output Source/Sink | Clock Frequency | Data Rate (Max) | Delay Time | Signal Conditioning | Capacitance - Input | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. NX2A4WPZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | -40°C ~ 85°C | Wireless Power Receiver | Surface Mount | 42-UFBGA, WLCSP | NX2 | 12mA | 6.1V ~ 18V | 42-WLCSP (3.56x3.41) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935303902012 | OBSOLETE | 0000.00.0000 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5744PFK1MLQ5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5744 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322048557 | OBSOLETE | 0000.00.0000 | 300 | 79 | e200z4 | 32-Bit Dual-Core | 150MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5744PK1MLQ9 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5744 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320645557 | OBSOLETE | 0000.00.0000 | 300 | 79 | e200z4 | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. SPC5744PK1MLQ9R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC57xx | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | SPC5744 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320645528 | OBSOLETE | 0000.00.0000 | 700 | 79 | e200z4 | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | DMA, LVD, POR, WDT | 2.5MB (2.5M x 8) | FLASH | - | 384K x 8 | 3.15V ~ 5.5V | A/D 64x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC10XS6325BEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Status Flag | MC10XS6325 | - | - | - | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934071606574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 3 | Open Load Detect, Over Temperature | High Side | 10mOhm, 25mOhm | 7V ~ 18V | General Purpose | 4.5A, 9A | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC17XS6400CEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC17XS6400 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934071599574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 5 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC17XS6500CEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM | MC17XS6500 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070566574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC22XS4200CEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM, Slew Rate Controlled | MC20XS4200 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934071643574 | EAR99 | 8542.39.0001 | 42 | 3V ~ 5.5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 22mOhm | 8V ~ 36V | General Purpose | 4.2A | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MQ5CVAHZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MQ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 621-FBGA, FCBGA | MIMX8MQ5 | 621-FCPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A53 | 1.3GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | EBI/EMI, I²C, PCIe, SPI, UART, uSDHC | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MQ6DVAJZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MQ | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 621-FBGA, FCBGA | MIMX8MQ6 | 621-FCPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A53 | 1.5GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | EBI/EMI, I²C, PCIe, SPI, UART, uSDHC | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. TEA1999TK/2J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | GreenChip™ | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Active/Synchronous Rectification Controller | Surface Mount | 8-VDFN Exposed Pad | TEA1999 | 250 µA | - | Not Verified | 0V ~ 21V | 8-HVSON (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 12,000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE14Z32VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE14Z32 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE14Z64VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE14Z64 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE15Z32VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE15Z32 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MKE16Z32VLD4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE16Z32 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 12x12b; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM3DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM3 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378335557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM3CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM3 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378342557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM2DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM2 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378334557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 1 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MIMX8MM1CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM1 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378339557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 1 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. PTN36502HQX | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | USB Type C | Surface Mount | 24-XFQFN Exposed Pad | Buffer, ReDriver | PTN36502 | 225mA | - | Differential | Differential | 1.7V ~ 1.9V | 24-HX2QFN (2.4x3.2) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | 5.4Gbps | 140ps | Input Equalization, Output De-Emphasis | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. PTN36502AHQX | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C (TA) | USB Type C | Surface Mount | 24-XFQFN Exposed Pad | Buffer, ReDriver | PTN36502 | 225mA | - | Differential | Differential | 1.7V ~ 1.9V | 24-HX2QFN (2.4x3.2) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | 5.4Gbps | 140ps | Input Equalization, Output De-Emphasis | 10 pF | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. LPC55S66JEV98K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | LPC55S6x | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 98-VFBGA | LPC55S66 | 98-VFBGA (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935376967557 | 5A992C | 8542.31.0001 | 1,300 | 64 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 144K x 8 | 1.8V ~ 3.6V | A/D 10x16b | Internal | |||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. PCAL6534EVJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Agile | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 42-VFBGA | POR | PCAL6534 | Open Drain, Push-Pull | 1.65V ~ 5.5V | 42-VFBGA (2.6x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 5,000 | 34 | I²C | Yes | - | 1 MHz | |||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S9S12VRP64F0MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 250 | 28 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 6x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL4CSC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9S08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 98 | 6 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08PL16CTG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 96 | 14 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 6x10b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. FS32R274KSK2VMM | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32R | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 257-LFBGA | FS32R274 | 257-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 152 | e200z4, e200z7 (2) | 32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire | POR, PWM, WDT | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19V ~ 5.5V | A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. FS32K146HAT0MMHT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | FS32K146 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 880 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 24x12b SAR; D/A1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08QL4CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX280CVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX280 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369795557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
Please send RFQ , we will respond immediately.