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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Technology | Current - Supply | Voltage - Input | Digi-Key Programmable | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Standards | Current - Output / Channel | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Load Type | Rds On (Typ) | Current - Peak Output | Voltage - Load | Voltage - Output |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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NXP USA Inc. MC68LK332GCAG16 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MC6833 | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | MC68LK332 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MC68LK332GCAG16 | EAR99 | 8542.31.0000 | 11 | 16 | CPU32 | 32-Bit Single-Core | 16MHz | EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | - | ROMless | - | 2K x 8 | - | - | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MKL27Z32VLH4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | KL27 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKL27Z32 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MKL27Z32VLH4 | 3A991A2 | 8542.31.0000 | 50 | 51 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, FlexIO, SPI, UART/USART, USB | DMA, I²S, PWM, WDT | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 3.6V | A/D 19x16b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC7457TRX1000NC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 483-BCBGA, FCCBGA | 483-FCCBGA (29x29) | RoHS non-compliant | 1 (Unlimited) | REACH info available upon request | 2832-MC7457TRX1000NC | 3A991A1 | 8542.31.0000 | 36 | PowerPC G4 | 1GHz | 1 Core, 32-Bit | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | - | - | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MCIMX6U1AVM08ACR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Not For New Designs | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH info available upon request | 2832-MCIMX6U1AVM08ACRTR | 5A992C | 8542.31.0000 | 7 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | DDR3, DDR3L, LPDDR2 | Yes | HDMI, Keypad, LCD, LVDS, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Bluetooth, CAN, ESAI, I²C, I²S, MMC/SD/SDIO, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||
|
NXP USA Inc. M83263G13 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Bulk | Obsolete | ROHS3 Compliant | 4 (72 Hours) | REACH info available upon request | 2832-M83263G13 | 5A002A1 | 8542.31.0000 | 60 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC7457VG1000NC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 483-BCBGA, FCCBGA | 483-FCCBGA (29x29) | ROHS3 Compliant | 1 (Unlimited) | REACH info available upon request | 2832-MC7457VG1000NC | 3A991A1 | 8542.31.0000 | 36 | PowerPC G4 | 1GHz | 1 Core, 32-Bit | Multimedia; SIMD | - | No | - | - | - | - | 1.5V, 1.8V, 2.5V | - | - | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. NE57810TK/1Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | 0°C ~ 70°C (TA) | Converter, DDR SDRAM | Surface Mount | 10-VDFN Exposed Pad | 1.6V ~ 3.6V | 10-HVSON (10x10) | REACH Unaffected | OBSOLETE | 1 | 1 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. SC18IM704PWJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | 16-TSSOP (0.173", 4.40mm Width) | 4mA | 1.71V ~ 3.6V | 16-TSSOP | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | Controller | - | I²C | UART | ||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5534JBD64K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5534 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 800 | 39 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5534JBD100K | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC5534 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 66 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | - | 96K x 8 | 1.8V ~ 3.6V | A/D 23x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5536JBD100E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | LPC5536 | 100-HLQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 90 | 66 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 23x16b; D/A 2x12b | Internal | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LPC5536JBD64E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-TQFP Exposed Pad | LPC5536 | 64-HTQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 39 | ARM® Cortex®-M33 | 32-Bit Single-Core | 150MHz | CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART | DMA, PWM, WDT | 256KB (256K x 8) | FLASH | - | 128K x 8 | 1.8V ~ 3.6V | A/D 13x16b; D/A 1x12b | Internal | |||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MC33879BPEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | MC33879 | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MC33879BPEKR2TR | EAR99 | 8542.39.0001 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SE050F2HQ1/Z018HZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | - | Surface Mount | 20-XFQFN Exposed Pad | Plug and Trust Secure Element | Not Verified | 20-HX2QFN (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 568-SE050F2HQ1/Z018HZTR | 3,000 | |||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MIMX8MN6DVTJZDA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | 486-LFBGA (14x14) | REACH Unaffected | OBSOLETE | 1 | ARM® Cortex®-A53, ARM® Cortex®-M7 | 1.5GHz, 750MHz | 5 Core, 64-Bit | Multimedia; NEON™ MPE | DDR3L, DDR4, LPDDR4 | Yes | MIPI-CSI, MIPI-DSI, LCD | GbE | - | USB 2.0 OTG + PHY (1) | 1.8V, 2.5V, 3.3V | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | AC'97, I²C, I²S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART | |||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC54016JET180 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54016 | 180-TFBGA (12x12) | RoHS non-compliant | Not Applicable | Vendor Undefined | 2832-LPC54016JET180 | 3A991A2 | 8542.31.0000 | 64 | 145 | ARM® Cortex®-M4 | 32-Bit | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | ROMless | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC11E13FBD48/301 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | LPC11 | 48-LQFP (7x7) | RoHS non-compliant | Not Applicable | Vendor Undefined | 2832-LPC11E13FBD48/301 | 3A991A2 | 8542.31.0000 | 97 | 40 | ARM® Cortex®-M0 | 32-Bit | 50MHz | I²C, Microwire, SPI, SSI, SSP, UART/USART | Brown-out Detect/Reset, POR, WDT | 24KB (24K x 8) | FLASH | 2K x 8 | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b SAR | Internal | ||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. LPC54S016JET180 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 180-TFBGA | LPC54S016 | 180-TFBGA (12x12) | RoHS non-compliant | Not Applicable | Vendor Undefined | 2832-LPC54S016JET180 | 5A992C | 8542.31.0000 | 31 | 145 | ARM® Cortex®-M4 | 32-Bit | 180MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | - | ROMless | - | 360K x 8 | 1.71V ~ 3.6V | A/D 12x12b SAR | External, Internal | ||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE13Z256VLF7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MKE13Z256 | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 1,250 | 42 | ARM® Cortex®-M0+ | 32-Bit | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | - | 48K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE12Z128VLF7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MKE12Z128 | 48-LQFP (7x7) | download | ROHS3 Compliant | REACH Unaffected | 1,250 | 42 | ARM® Cortex®-M0+ | 32-Bit | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 5.5V | A/D 11x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMXRT1061XVN5B | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1060 | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 225-LFBGA | MIMXRT1061 | 225-MAPBGA (13x13) | download | ROHS3 Compliant | REACH Unaffected | 568-MIMXRT1061XVN5B | 800 | 149 | ARM® Cortex®-M7 | 32-Bit | 500MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | 128KB (128K x 8) | ROM | - | 1M x 8 | 3V ~ 3.6V | A/D 20x12b | Internal | |||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MGD3160AM535EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C (TA) | General Purpose | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) | - | MGD3160 | IGBT | 4.75V ~ 40V | 32-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 568-MGD3160AM535EK | 42 | 15A | PWM, SPI | Over Temperature, Short Circuit | Half Bridge | - | 500mOhm | - | 12V ~ 25V | |||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. PN7362BNHN/C300Y | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | PN7362 | REACH Unaffected | 568-PN7362BNHN/C300Y | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. MF0ULH3101DUFV | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | Not Verified | REACH Unaffected | 568-MF0ULH3101DUFV | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. PN7362BNHN/C300E | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | PN7362 | REACH Unaffected | 568-PN7362BNHN/C300E | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAC7116J0VAG50R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | SAC71 | REACH Unaffected | OBSOLETE | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. SAC7111J1VAG50R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Bulk | Obsolete | SAC71 | REACH Unaffected | OBSOLETE | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234CTN1VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Obsolete | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | ROHS3 Compliant | REACH Unaffected | 568-FS32V234CTN1VUB | OBSOLETE | 1 | ARM® Cortex®-A53 | 1GHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V234BJN2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V234BJN2VUB | 1 | ARM® Cortex®-A53 | 800MHz | 4 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART | ||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. FS32V232BMN2VUB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | FS32V23 | Bulk | Active | -40°C ~ 125°C (TJ) | Surface Mount | 621-FBGA, FCBGA | 621-FCPBGA (17x17) | download | REACH Unaffected | 568-FS32V232BMN2VUB | 1 | ARM® Cortex®-A53 | 800MHz | 2 Core, 32/64-Bit | ARM® Cortex®-M4 | DDR3, DDR3L, LPDDR2 | No | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | GbE | - | - | 1V, 1.8V, 3.3V | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | I²C, SPI, PCI, UART |
