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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Current - Supply | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MC17XS6400CEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC17XS6400 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934071599574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 5 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC17XS6500CEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM | MC17XS6500 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070566574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 6 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 17mOhm | 7V ~ 18V | General Purpose | 5.5A | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC22XS4200CEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Internal PWM, Slew Rate Controlled | MC20XS4200 | - | N-Channel | 1:1 | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934071643574 | EAR99 | 8542.39.0001 | 42 | 3V ~ 5.5V | SPI | 2 | Open Load Detect, Over Temperature | High Side | 22mOhm | 8V ~ 36V | General Purpose | 4.2A | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MQ5CVAHZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MQ | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 621-FBGA, FCBGA | MIMX8MQ5 | 621-FCPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A53 | 1.3GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | EBI/EMI, I²C, PCIe, SPI, UART, uSDHC | |||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MQ6DVAJZAB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MQ | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 621-FBGA, FCBGA | MIMX8MQ6 | 621-FCPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 90 | ARM® Cortex®-A53 | 1.5GHz | 4 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | eDP, HDMI, MIPI-CSI, MIPI-DSI | GbE | - | USB 3.0 (2) | - | ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS | EBI/EMI, I²C, PCIe, SPI, UART, uSDHC | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. FS32K116LAT0MFMT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | FS32K116 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 490 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 17K x 8 | 2.7V ~ 5.5V | A/D 13x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. FS32K116LAT0MLFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | FS32K116 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 250 | 43 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | DMA, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 17K x 8 | 2.7V ~ 5.5V | A/D 13x12b SAR; D/A 1x8b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08QL4CTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tube | Active | -40°C ~ 85°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | MC9S08 | 20-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 75 | 18 | S08 | 8-Bit | 20MHz | LINbus, SCI | LVD, PWM, WDT | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. FS32K146HAT0MMHT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S32K | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LFBGA | FS32K146 | 100-MAPBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 880 | 89 | ARM® Cortex®-M4F | 32-Bit Single-Core | 80MHz | CANbus, FlexIO, I²C, LINbus, SPI, UART/USART | POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 128K x 8 | 2.7V ~ 5.5V | A/D 24x12b SAR; D/A1x8b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX280CVM4C | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX28 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 289-LFBGA | MCIMX280 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935369795557 | 5A992C | 8542.31.0001 | 760 | ARM926EJ-S | 454MHz | 1 Core, 32-Bit | Data; DCP | LVDDR, LVDDR2, DDR2 | No | Keypad | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 3.3V | Boot Security, Cryptography, Hardware ID | I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TDF8546JV/N2ZU | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | - | Through Hole | 27-SIP, Formed Leads | Class AB | - | TDF8546 | 4-Channel (Quad) | 6V ~ 18V | DBS27P | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935358784112 | 0000.00.0000 | 456 | 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TDF8546AJV/N1ZU | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | - | Through Hole | 27-SIP, Formed Leads | Class AB | - | TDF8546 | 4-Channel (Quad) | 6V ~ 18V | DBS27P | ROHS3 Compliant | Not Applicable | REACH Unaffected | 935358763112 | 0000.00.0000 | 456 | 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm, 40W x 4 @ 4Ohm | |||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8101A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8 Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8101 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8100CDES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8100CGES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC34PF8100CDEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount | 56-VFQFN Exposed Pad | MC34PF8100 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DAES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 260 | |||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DFES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935376117557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC33PF8200DHES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 105°C (TA) | High Performance i.MX 8, S32x Processor Based | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC33PF8200 | - | 2.5V ~ 5.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935382397557 | 0000.00.0000 | 260 | ||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S912ZVMAL3F0WLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP | S912 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 22 | S12Z | 16-Bit | 32MHz | LINbus, SCI, SPI | PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 2K x 8 | 3.5V ~ 20V | A/D 7x10b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1128ATK/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 14-VDFN Exposed Pad | Transceiver | TJA1128 | 5V ~ 28V | 14-HVSON (3x4.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LIN | 1/1 | Full | 20kBd | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1128BTK/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 14-VDFN Exposed Pad | Transceiver | TJA1128 | 5V ~ 28V | 14-HVSON (3x4.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LIN | 1/1 | Full | 20kBd | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1128FTK/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 14-VDFN Exposed Pad | Transceiver | TJA1128 | 5V ~ 28V | 14-HVSON (3x4.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | LIN | 1/1 | Full | 20kBd | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1044VTKZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-VDFN Exposed Pad | Transceiver | TJA1044 | 4.75V ~ 5.25V | 8-HVSON (3x3) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 6,000 | CANbus | 1/1 | Half | 300 mV | 5Mbps | ||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1044VTZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | TJA1044 | 4.75V ~ 5.25V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 2,500 | CANbus | 1/1 | Half | 300 mV | 5Mbps | ||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1124AHG/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 24-VFQFN Exposed Pad | Transceiver | TJA1124 | 5V ~ 28V | 24-DHVQFN (5.5x3.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | LIN | 4/4 | Full | 20kBd | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. TJA1124BHG/0Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 150°C (TJ) | Surface Mount | 24-VFQFN Exposed Pad | Transceiver | TJA1124 | 5V ~ 28V | 24-DHVQFN (5.5x3.5) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.39.0001 | 3,000 | LIN | 4/4 | Full | 20kBd | |||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC9S08PL32CLD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 42 | S08 | 8-Bit | 20MHz | LINbus, SCI, UART/USART | LVD, POR, PWM | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 12x10b | Internal | ||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM3DVTLZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM3 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378335557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.8GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART | |||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MIMX8MM3CVTKZAA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX8MM | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 486-LFBGA, FCBGA | MIMX8MM3 | 486-LFBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935378342557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A53 | 1.6GHz | 2 Core, 64-Bit | ARM® Cortex®-M4 | DDR3L, DDR4, LPDDR4 | Yes | MIPI-DSI | GbE | - | USB 2.0 + PHY (2) | - | ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS | I²C, PCIe, SDHC, SPI, UART |
