Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Features | Base Product Number | Input Type | Technology | Current - Supply | Output Type | Ratio - Input:Output | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Max Output Power x Channels @ Load | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Clock Frequency | Number of Outputs | Memory Type | Memory Size | Memory Format | Memory Organization | Memory Interface | Write Cycle Time - Word, Page | Fault Protection | Output Configuration | Rds On (Typ) | Voltage - Load | Switch Type | Current - Output (Max) |
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NXP USA Inc. S912ZVML64F1MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312248557 | OBSOLETE | 0000.00.0000 | 160 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S912ZVML64F2MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318489528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. S912ZVML64F2WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Obsolete | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320695528 | OBSOLETE | 0000.00.0000 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC08XS6421BEKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | - | MC08XS6421 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070614518 | EAR99 | 8542.39.0001 | 1,000 | 4.5V ~ 5.5V | SPI | 4 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 8mOhm, 21mOhm | 7V ~ 18V | General Purpose | 5.5A, 11A | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC40XS6500BEK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | Slew Rate Controlled | MC40XS6500 | - | N-Channel | 1:1 | 32-HSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070564574 | EAR99 | 8542.39.0001 | 42 | 4.5V ~ 5.5V | SPI | 5 | Current Limiting (Fixed), Open Load Detect, Over Temperature | High Side | 40mOhm | 7V ~ 18V | General Purpose | 3.9A | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC8640DHJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | 0°C ~ 105°C (TA) | Surface Mount | 1023-BCBGA, FCBGA | MC8640DHJ1250 | 1023-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 2 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC8640DTHJ1067NE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 1023-BCBGA, FCBGA | MC8640DTHJ1067 | 1023-FCCBGA (33x33) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A1 | 8542.31.0001 | 24 | PowerPC e600 | 1.067GHz | 2 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC8640DTHJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 1023-BCBGA, FCBGA | MC8640DTHJ1250 | 1023-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343657557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 2 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC8640THJ1250HE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MPC86xx | Tray | Obsolete | -40°C ~ 105°C (TA) | Surface Mount | 994-BCBGA, FCCBGA | MC8640THJ1250 | 994-FCCBGA (33x33) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935343662557 | OBSOLETE | 0000.00.0000 | 24 | PowerPC e600 | 1.25GHz | 1 Core, 32-Bit | - | DDR, DDR2 | No | - | 10/100/1000Mbps (4) | - | - | 1.8V, 2.5V, 3.3V | - | DUART, HSSI, I²C, RapidIO | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC9S08SU16VFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-UFQFN Exposed Pad | MC9S08 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 17 | S08 | 8-Bit | 40MHz | I²C, SCI | PWM, WDT | 16KB (16K x 8) | FLASH | - | 768 x 8 | 4.5V ~ 18V | A/D 8x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MK28FN2M0CAU15R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K28F | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 210-UFBGA, WLCSP | MK28FN2M0 | 210-WLCSP (6.94x6.94) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935339339058 | 3A991A2 | 8542.31.0001 | 3,000 | 120 | ARM® Cortex®-M4 | 32-Bit Single-Core | 150MHz | EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB | DMA, I²S, PWM, WDT | 2MB (2M x 8) | FLASH | - | 1M x 8 | 1.71V ~ 3.6V | A/D 16b SAR; D/A 2x6b, 1x12b | External, Internal | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX7D2DVK12SC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7D | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 488-TFBGA | MCIMX7 | 488-TFBGA (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.2GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX7D2DVM12SC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7D | Tray | Active | 0°C ~ 85°C (TJ) | Surface Mount | 541-LFBGA | MCIMX7 | 541-MAPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.2GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Y2CVM08AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 792MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | ||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6Y2DVM09AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 900MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. NXH5104UK/A1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -20°C ~ 85°C (TA) | Surface Mount | 13-XFBGA, WLCSP | NXH5104 | EEPROM | 1V ~ 2.6V | 13-WLCSP (2.8x2.74) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991B1B1 | 8542.32.0051 | 2,000 | 10 MHz | Non-Volatile | 4Mbit | EEPROM | 512K x 8 | SPI | - | ||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G2CVK05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G3DVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX7D7DVK10SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7D | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 488-TFBGA | MCIMX7 | 488-TFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935352047557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. TJA1028T/3V3/20/DZ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | Transceiver | TJA1028 | 3.3V | 8-SO | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935306846431 | EAR99 | 8542.39.0001 | 2,500 | LINbus | 1/1 | Half | 200 mV | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G1AVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935346151557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LVDS | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | |||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G1CVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LVDS | 10/100Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MCIMX6G3CVM05AB | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6UL | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 760 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, DDR3, DDR3L | No | LCD, LVDS | 10/100Mbps (2) | - | USB 2.0 + PHY (2) | 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | CAN, EBI/EMI, I²C, I²S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART | ||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. TFA9896UK/N1Z | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 30-UFBGA, WLCSP | Class D | Depop, Short-Circuit and Thermal Protection | TFA9896 | 1-Channel (Mono) | 2.8V ~ 5.5V | 30-WLCSP (2.72x2.06) | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8542.33.0001 | 4,000 | 2.1W x 1 @ 8Ohm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33663BJEF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | Transceiver | MC336 | 7V ~ 18V | 14-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311424574 | OBSOLETE | 0000.00.0000 | 55 | LIN | 2/2 | Half | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33663BLEFR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | Transceiver | MC336 | 7V ~ 18V | 14-SOIC | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311423518 | OBSOLETE | 0000.00.0000 | 2,500 | LIN | 2/2 | Half | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33909D3ADR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33909 | 7mA | 3.5V ~ 28V | 48-LQFP-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320729564 | OBSOLETE | 0000.00.0000 | 1,500 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33909D5AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33909 | 7mA | 3.5V ~ 28V | 48-LQFP-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318437557 | OBSOLETE | 0000.00.0000 | 250 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33909L3ADR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33909 | 7mA | 3.5V ~ 28V | 48-LQFP-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320728564 | OBSOLETE | 0000.00.0000 | 1,500 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
NXP USA Inc. MC33909L5ADR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33909 | 7mA | 3.5V ~ 28V | 48-LQFP-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322212564 | OBSOLETE | 0000.00.0000 | 1,500 |
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