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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Features | Base Product Number | Input Type | Voltage - Input | Voltage - Input (Max) | Output Type | Ratio - Input:Output | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Number of Outputs | Current - Quiescent (Iq) | Fault Protection | Control Features | Output Configuration | Current - Output | Rds On (Typ) | Voltage - Load | Voltage - Output | Switch Type | Current - Output (Max) | Voltage - Output (Min/Fixed) | Voltage - Output (Max) | Number of Regulators | Voltage Dropout (Max) | PSRR | Protection Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S9S12GN16F1CLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319879528 | EAR99 | 8542.31.0001 | 2,000 | 26 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S12GN16F1MLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311279528 | 3A991A2 | 8542.31.0001 | 2,000 | 26 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S12GN32F0MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S12 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 40 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S12P128J0VFTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | ||||||||||||||||||||||||||||||||||||||||||
 |
NXP USA Inc. MC10XS3412JHFK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 150°C (TJ) | Surface Mount | 24-PowerQFN | Internal PWM, Slew Rate Controlled, Watchdog Timer | MC10XS3412 | - | N-Channel | 1:1 | 24-PQFN (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 168 | 3V ~ 5.5V | SPI | 4 | Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage | High Side | 10mOhm, 12mOhm | 6V ~ 20V | General Purpose | - | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MC16XSD200FK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Obsolete | -40°C ~ 150°C (TJ) | Surface Mount | 23-PowerQFN | Internal PWM, Slew Rate Controlled, Watchdog Timer | MC16XSD200 | - | N-Channel | 1:1 | 23-PQFN (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 934070599557 | EAR99 | 8542.39.0001 | 840 | 3V ~ 5.5V | SPI | 2 | Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage | High Side | 16mOhm (Max) | 8V ~ 36V | General Purpose | 3A | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6D5EYM10AD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6D | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA, FCBGA | MCIMX6 | 624-FCPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U1AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U4AVM08AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -40°C ~ 125°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 800MHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U5DVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323455557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCIMX6U5EVM10AC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6DL | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 624-LFBGA | MCIMX6 | 624-MAPBGA (21x21) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324722557 | 5A992C | 8542.31.0001 | 60 | ARM® Cortex®-A9 | 1.0GHz | 2 Core, 32-Bit | Multimedia; NEON™ SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MK64FX512VDC12 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK64FX512 | 121-XFBGA (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323475557 | 3A991A2 | 8542.31.0001 | 348 | 86 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | 4K x 8 | 192K x 8 | 1.71V ~ 3.6V | A/D 37x16b; D/A 2x12b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE02Z16VLC2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKE02Z16 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314884557 | 3A991A2 | 8542.31.0001 | 250 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE02Z16VLD2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE02Z16 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320029557 | 3A991A2 | 8542.31.0001 | 160 | 37 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE02Z32VLD2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | MKE02Z32 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321812557 | 3A991A2 | 8542.31.0001 | 160 | 37 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKE02Z32VLH2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE02Z32 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 160 | 57 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKL02Z16VFG4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL02 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN Exposed Pad | MKL02Z16 | 16-QFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 490 | 14 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 6x12b | Internal | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MKM33Z64CLH5 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KM | Tray | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | MKM33Z64 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311207557 | 3A991A2 | 8542.31.0001 | 160 | 38 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 50MHz | I²C, SPI, UART/USART | DMA, LCD, WDT | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 6x16b, 4x24b | Internal | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0100F1AEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0100 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 12 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. MMPF0200F0AEP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C (TA) | Converter, i.MX6 | Surface Mount | 56-VFQFN Exposed Pad | MMPF0200 | 2.8V ~ 4.5V | 56-HVQFN (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | 11 | Multiple | ||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. P2010NSE2NHC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | QorIQ P2 | Tray | Obsolete | 0°C ~ 125°C (TA) | Surface Mount | 689-BBGA Exposed Pad | P2010 | 689-TEPBGA II (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318261557 | 5A002A1 FRE | 8542.31.0001 | 27 | PowerPC e500v2 | 1.2GHz | 1 Core, 32-Bit | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000Mbps (3) | - | USB 2.0 + PHY (2) | - | Cryptography, Random Number Generator | DUART, I²C, MMC/SD, SPI | ||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S12GN16F1MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S12 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,250 | 26 | 12V1 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S12HY64J0VLL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | S9S12 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 450 | 80 | HCS12 | 16-Bit | 32MHz | CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI | LCD, Motor control PWM, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 4K x 8 | 4K x 8 | 4.5V ~ 5.5V | A/D 8x10b | Internal | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S12P32J0CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-TFQFN Exposed Pad | S9S12 | 48-QFN-EP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310136557 | 3A991A2 | 8542.31.0001 | 1,300 | 34 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 4K x 8 | 2K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. S9S12P96J0CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S12 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310638557 | 3A991A2 | 8542.31.0001 | 800 | 49 | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | 4K x 8 | 6K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | |||||||||||||||||||||||||||||||||||||||||
|
NXP USA Inc. HEC4040BT-Q100J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tape & Reel (TR) | Active | HEC4040 | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 935302472118 | EAR99 | 8542.39.0001 | 2,500 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LD6938CX6/1218PLJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Surface Mount | 6-XFBGA, WLCSP | LD693 | 5.5V | Fixed | 6-WLCSP (1.2x0.80) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 934067732118 | EAR99 | 8542.39.0001 | 4,500 | 75 µA | Enable | Positive | 300mA, 300mA | 1.2V, 1.8V | - | 2 | 0.4V @ 300mA, 0.4V @ 300mA | 80dB (1kHz) | Over Current, Over Temperature, Soft Start | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LD6938CX6/1818HF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Surface Mount | 6-XFBGA, WLCSP | LD6938 | 5.5V | Fixed | 6-WLCSP (1.2x0.80) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 934067257135 | EAR99 | 8542.39.0001 | 4,500 | 75 µA | Enable | Positive | 300mA, 300mA | 1.8V, 1.8V | - | 2 | 0.4V @ 300mA, 0.4V @ 300mA | 80dB (1kHz) | Over Current, Over Temperature, Soft Start | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LD6938CX6/1833PLJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Surface Mount | 6-XFBGA, WLCSP | LD693 | 5.5V | Fixed | 6-WLCSP (1.2x0.80) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 934067731118 | EAR99 | 8542.39.0001 | 4,500 | 75 µA | Enable | Positive | 300mA, 300mA | 1.8V, 3.3V | - | 2 | 0.4V @ 300mA, 0.4V @ 300mA | 80dB (1kHz) | Over Current, Over Temperature, Soft Start | |||||||||||||||||||||||||||||||||||||||||
| NXP USA Inc. LD6938CX6/3018PLJ | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Obsolete | -40°C ~ 85°C | Surface Mount | 6-XFBGA, WLCSP | LD693 | 5.5V | Fixed | 6-WLCSP (1.2x0.80) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 934067735118 | EAR99 | 8542.39.0001 | 4,500 | 75 µA | Enable | Positive | 300mA, 300mA | 1.8V, 3V | - | 2 | 0.4V @ 300mA, 0.4V @ 300mA | 80dB (1kHz) | Over Current, Over Temperature, Soft Start |
