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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Type | Base Product Number | Frequency | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Standards | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Interface |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MCZ33903D5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | CAN, LIN | ||||||||||||||||||||||
| NXP USA Inc. MCZ33903DD3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333163574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||
| NXP USA Inc. MCZ33903DP3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333199574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||
| NXP USA Inc. MCZ33903DP5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333218574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||
| NXP USA Inc. MCZ33903DS3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | ||||||||||||||||||||||
| NXP USA Inc. MCZ33903DS5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333189574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||
| NXP USA Inc. MCZ33904D5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33904 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | CAN | ||||||||||||||||||||||
| NXP USA Inc. MCZ33905DD3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33905 | 5.5V ~ 28V | 54-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333202574 | EAR99 | 8542.39.0001 | 26 | CAN, LIN | |||||||||||||||||||||
| NXP USA Inc. MCZ33905DS3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33905 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333215574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||
| NXP USA Inc. MCZ33905DS3EKR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33905 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333215518 | EAR99 | 8542.39.0001 | 1,000 | CAN, LIN | |||||||||||||||||||||
 |
NXP USA Inc. MF1P2101DA4/01J | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MIFARE PLUS™ | Tape & Reel (TR) | Obsolete | -25°C ~ 70°C (TA) | Surface Mount | MOA4, Smart Card Module | RFID Transponder | MF1P2 | 13.56MHz | - | PLLMC | download | REACH Unaffected | 935308513118 | OBSOLETE | 0000.00.0000 | 17,500 | ISO 14443, MIFARE | - | |||||||||||||||||||
|
NXP USA Inc. MF1S5037DUG,005 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | MIFARE® | Tray | Obsolete | -25°C ~ 70°C (TA) | Surface Mount | Die | RFID Transponder | MF1S5 | 13.56MHz | - | Wafer | 1 (Unlimited) | REACH Unaffected | 935292981005 | OBSOLETE | 0000.00.0000 | 26,000 | ISO 14443, MIFARE | - | |||||||||||||||||||
| NXP USA Inc. MIMXRT1052CVL5A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RT1050 | Tray | Active | -40°C ~ 105°C (TJ) | Surface Mount | 196-LFBGA | MIMXRT1052 | 196-LFBGA (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 240 | 127 | ARM® Cortex®-M7 | 32-Bit Single-Core | 528MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | External Program Memory | - | 512K x 8 | 3V ~ 3.6V | A/D 20x12b | External, Internal | |||||||||||
| NXP USA Inc. MK02FN64VFM10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K02 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MK02FN64 | 32-HVQFN (5x5) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323608528 | 3A991A2 | 8542.31.0001 | 5,000 | 26 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | I²C, SPI, UART/USART | DMA, LVD, POR, PWM | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 12x16b; D/A 1x12b | Internal | |||||||||||
| NXP USA Inc. MK10DN512VLK10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MK10DN512 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,000 | 56 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 31x16b; D/A 1x12b | Internal | |||||||||||
| NXP USA Inc. MK10DX128VLH7R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K10 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK10DX128 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324888528 | 3A991A2 | 8542.31.0001 | 1,500 | 44 | ARM® Cortex®-M4 | 32-Bit Single-Core | 72MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART | DMA, I²S, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 32K x 8 | 1.71V ~ 3.6V | A/D 26x16b; D/A 1x12b | Internal | |||||||||||
| NXP USA Inc. MK22FX512AVLH12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MK22FX512 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 40 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 22x16b; D/A 1x12b | Internal | ||||||||||||
| NXP USA Inc. MK22FX512VLQ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K20 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK22FX512 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312994528 | 3A991A2 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, I²C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71V ~ 3.6V | A/D 42x16b; D/A 2x12b | Internal | |||||||||||
| NXP USA Inc. MK60DN512VMC10R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-LFBGA | MK60DN512 | 121-MAPBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313053518 | 3A991A2 | 8542.31.0001 | 2,000 | 86 | ARM® Cortex®-M4 | 32-Bit Single-Core | 100MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 512KB (512K x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 38x16b; D/A 2x12b | Internal | |||||||||||
| NXP USA Inc. MK63FN1M0VLQ12R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K60 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | MK63FN1M0 | 144-LQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321973528 | 5A002A1 | 8542.31.0001 | 500 | 100 | ARM® Cortex®-M4 | 32-Bit Single-Core | 120MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 41x16b; D/A 2x12b | Internal | ||||||||||
| NXP USA Inc. MK70FN1M0VMJ15R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K70 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 256-LBGA | MK70FN1M0 | 256-MAPPBGA (17x17) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323155518 | 3A991A2 | 8542.31.0001 | 1,000 | 128 | ARM® Cortex®-M4 | 32-Bit Single-Core | 150MHz | CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | DMA, I²S, LCD, LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | - | 128K x 8 | 1.71V ~ 3.6V | A/D 71x16b; D/A 2x12b | Internal | |||||||||||
|
NXP USA Inc. MK81FN256VDC15R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis K8x | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 121-XFBGA | MK81FN256 | 121-XFBGA (8x8) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313043518 | 5A992C | 8542.31.0001 | 2,000 | 85 | ARM® Cortex®-M4 | 32-Bit Single-Core | 150MHz | EBI/EMI, I²C, SPI, UART/USART, USB OTG | DMA, I²S, LVD, POR, PWM | 256KB (256K x 8) | FLASH | - | 256K x 8 | 1.71V ~ 3.6V | A/D 17x16b; D/A 2x6b, 1x12b | Internal | ||||||||||
| NXP USA Inc. MKE04Z128VLH4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | MKE04Z128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320756528 | 3A991A2 | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 2x6b | Internal | ||||||||||
| NXP USA Inc. MKE04Z8VWJ4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE04 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | MKE04Z8 | 20-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317919518 | 3A991A2 | 8542.31.0001 | 1,000 | 18 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 10x12b; D/A 2x6b | Internal | ||||||||||
| NXP USA Inc. MKE14Z256VLL7 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KE1xZ | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 100-LQFP | MKE14Z256 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318532557 | 3A991A2 | 8542.31.0001 | 90 | 89 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 72MHz | FlexIO, I²C, SPI, UART/USART | DMA, LVD, PWM, WDT | 256KB (256K x 8) | FLASH | 34K x 8 | 32K x 8 | 2.7V ~ 5.5V | A/D 16x12b; D/A 1x8b | Internal | ||||||||||
| NXP USA Inc. MKL03Z32VFK4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL03 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | MKL03Z32 | 24-QFN (4x4) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312952528 | 3A991A2 | 8542.31.0001 | 5,000 | 22 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71V ~ 3.6V | A/D 7x12b | Internal | ||||||||||
| NXP USA Inc. MKL04Z8VLC4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL0 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | MKL04Z8 | 32-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 1K x 8 | 1.71V ~ 3.6V | A/D 14x12b | Internal | |||||||||||
| NXP USA Inc. MKL13Z32VLK4 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL13 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MKL13Z32 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312502557 | 3A991A2 | 8542.31.0001 | 96 | 70 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | FlexIO, I²C, IrDA, SPI, UART/USART | DMA, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | ||||||||||
| NXP USA Inc. MKL14Z32VFM4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 32-VFQFN Exposed Pad | MKL14Z32 | 32-HVQFN (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311277528 | 3A991A2 | 8542.31.0001 | 5,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 9x12b | Internal | ||||||||||
| NXP USA Inc. MKL16Z256VMP4R | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KL1 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LFBGA | MKL16Z256 | 64-MAPBGA (5x5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312291518 | 3A991A2 | 8542.31.0001 | 2,500 | 54 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I²C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Internal |
