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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S912ZVML12F3MKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334915528 | 3A991A2 | 8542.31.0001 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML12F3WKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 160 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 512 x 8 | 8K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | |||||
| NXP USA Inc. S912ZVML31F1MKFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | S912 | 48-LQFP-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322427528 | 3A991A2 | 8542.31.0001 | 2,000 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 4x12b | Internal | ||||
| NXP USA Inc. S912ZVML31F1MKH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935335932557 | 3A991A2 | 8542.31.0001 | 800 | 31 | S12Z | 16-Bit | 50MHz | LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 128 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S912ZVML32F3WKHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S12 MagniV | Tape & Reel (TR) | Active | -40°C ~ 150°C (TA) | Surface Mount | 64-LQFP Exposed Pad | S912 | 64-HLQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935334924528 | 3A991A2 | 8542.31.0001 | 1,500 | 31 | S12Z | 16-Bit | 50MHz | CANbus, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 512 x 8 | 4K x 8 | 3.5V ~ 40V | A/D 9x12b | Internal | ||||
| NXP USA Inc. S9KEAZ128AVLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | S9KEAZ128 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 1,500 | 58 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | CANbus, I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
 |
NXP USA Inc. S9KEAZN64AMLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | Kinetis KEA | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9KEAZN64 | 32-TQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322166528 | 3A991A2 | 8542.31.0001 | 2,000 | 28 | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | ||||
| NXP USA Inc. S9S08AW16AE0MLDR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321272528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW16E7MFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318023557 | 3A991A2 | 8542.31.0001 | 800 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E5CPUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309899528 | 3A991A2 | 8542.31.0001 | 1,500 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E5MFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-QFP | S9S08 | 64-QFP (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309682528 | 3A991A2 | 8542.31.0001 | 750 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E7CFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313378557 | 3A991A2 | 8542.31.0001 | 800 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW32E7VFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 44-LQFP | S9S08 | 44-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315019557 | 3A991A2 | 8542.31.0001 | 160 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | |||||
| NXP USA Inc. S9S08AW48E5MPUE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316965557 | 3A991A2 | 8542.31.0001 | 800 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. S9S08AW8AE0CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317928557 | 3A991A2 | 8542.31.0001 | 1,250 | 22 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 768 x 8 | 2.7V ~ 5.5V | A/D 6x10b | Internal | |||||
| NXP USA Inc. S9S08AW8AE0MLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317021557 | 3A991A2 | 8542.31.0001 | 1,250 | 22 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 768 x 8 | 2.7V ~ 5.5V | A/D 6x10b | Internal | |||||
| NXP USA Inc. S9S08DN32F2CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311865557 | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 1.5K x 8 | 2.7V ~ 5.5V | A/D 10x12b | Internal | |||||
| NXP USA Inc. S9S08DN32F2MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935314792557 | 3A991A2 | 8542.31.0001 | 800 | 53 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 1.5K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
| NXP USA Inc. S9S08DN32F2VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311124557 | 3A991A2 | 8542.31.0001 | 1,250 | 39 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 1.5K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
| NXP USA Inc. S9S08DN48F2MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321768557 | 3A991A2 | 8542.31.0001 | 800 | 53 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
| NXP USA Inc. S9S08DN48F2VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315219557 | 3A991A2 | 8542.31.0001 | 250 | 39 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (48K x 8) | FLASH | 1.5K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
| NXP USA Inc. S9S08DV128F2CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935321723528 | 3A991A2 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 6K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
| NXP USA Inc. S9S08DV96F2CLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310279528 | 3A991A2 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 96KB (96K x 8) | FLASH | - | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | |||||
| NXP USA Inc. S9S08DZ128F2MLHR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | S9S08 | 64-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317992528 | 3A991A2 | 8542.31.0001 | 1,500 | 53 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.7V ~ 5.5V | A/D 24x12b | Internal | ||||
| NXP USA Inc. S9S08DZ128F2MLLR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 100-LQFP | S9S08 | 100-LQFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320336528 | 3A991A2 | 8542.31.0001 | 1,000 | 87 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.7V ~ 5.5V | A/D 24x12b | Internal | ||||
| NXP USA Inc. S9S08DZ32F2CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317672557 | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | |||||
| NXP USA Inc. S9S08DZ32F2MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311515528 | 3A991A2 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||||
| NXP USA Inc. S9S08DZ32F2VLC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323308557 | 3A991A2 | 8542.31.0001 | 1,250 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | |||||
| NXP USA Inc. S9S08DZ32F2VLCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 32-LQFP | S9S08 | 32-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 2,000 | 25 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 10x12b | External | ||||||
| NXP USA Inc. S9S08DZ32F2VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | S9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935325691557 | 3A991A2 | 8542.31.0001 | 250 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External |
