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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Number of I/O | Core Processor | Core Size | Speed | Connectivity | Peripherals | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. S912XEG384BCAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311318528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||
| NXP USA Inc. S912XEG384BMAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318056557 | 3A991A2 | 8542.31.0001 | 60 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |||||
| NXP USA Inc. S912XEG384BVAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324639557 | 3A991A2 | 8542.31.0001 | 60 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |||||
| NXP USA Inc. S912XEG384F0CALR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315084528 | 3A991A2 | 8542.31.0001 | 500 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |||||
| NXP USA Inc. S912XEG384F0VAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315057557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |||||
| NXP USA Inc. S912XEG384F1VAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311227557 | 3A991A2 | 8542.31.0001 | 300 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 384KB (384K x 8) | FLASH | 4K x 8 | 24K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||
| NXP USA Inc. S912XEP100AVAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315259557 | 3A991A2 | 8542.31.0001 | 60 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||
| NXP USA Inc. S912XEP100J4MAL | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 112-LQFP | S912 | 112-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935309722557 | 3A991A2 | 8542.31.0001 | 300 | 91 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 16x12b | External | |||||
| NXP USA Inc. S912XEP100W1MAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317968528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 1MB (1M x 8) | FLASH | 4K x 8 | 64K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||
| NXP USA Inc. S912XEP768W1CAG | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tray | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320165557 | 3A991A2 | 8542.31.0001 | 60 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 768KB (768K x 8) | FLASH | 4K x 8 | 48K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||
| NXP USA Inc. S912XEP768W1CAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HCS12X | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 144-LQFP | S912 | 144-LQFP (20x20) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320165528 | 3A991A2 | 8542.31.0001 | 500 | 119 | HCS12X | 16-Bit | 50MHz | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | LVD, POR, PWM, WDT | 768KB (768K x 8) | FLASH | 4K x 8 | 48K x 8 | 1.72V ~ 5.5V | A/D 24x12b | External | |||||
| NXP USA Inc. MC56F8246MLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC56F82 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317808528 | 3A991A2 | 8542.31.0001 | 2,000 | 39 | 56800E | 16-Bit | 60MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 48KB (24K x 16) | FLASH | - | 3K x 16 | 3V ~ 3.6V | A/D 10x12b; D/A 1x12b | Internal | ||||
| NXP USA Inc. MC56F82746MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC56F82 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935335298557 | 3A991A2 | 8542.31.0001 | 250 | 39 | 56800EX | 32-Bit Single-Core | 100MHz | CANbus, I²C, SCI, SPI | DMA, POR, PWM, WDT | 64KB (32K x 16) | FLASH | - | 4K x 16 | 2.7V ~ 3.6V | A/D 10x12b; D/A 2x12b | Internal | ||||
| NXP USA Inc. MC56F84565VLKR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MC56F84 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315873528 | 3A991A2 | 8542.31.0001 | 1,000 | 68 | 56800EX | 32-Bit Single-Core | 80MHz | CANbus, I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 24K x 8 | 3V ~ 3.6V | A/D 16x12b, 8x16b | Internal | ||||
| NXP USA Inc. MC56F84766VLKR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | 56F8xxx | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 80-LQFP | MC56F84 | 80-FQFP (12x12) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319888528 | 3A991A2 | 8542.31.0001 | 1,000 | 68 | 56800EX | 32-Bit Single-Core | 100MHz | CANbus, I²C, LINbus, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | 2K x 8 | 24K x 8 | 3V ~ 3.6V | A/D 16x12b, 10x16b; D/A 1x12b | Internal | ||||
| NXP USA Inc. MC908QY8CDWER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | HC08 | Tape & Reel (TR) | Not For New Designs | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | MC908 | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313224518 | EAR99 | 8542.31.0001 | 1,000 | 13 | HC08 | 8-Bit | 8MHz | - | LVD, POR, PWM | 8KB (8K x 8) | FLASH | - | 256 x 8 | 2.7V ~ 5.5V | A/D 4x10b | External | ||||
| NXP USA Inc. MC9RS08KA8CTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RS08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9RS08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 5,000 | 14 | RS08 | 8-Bit | 20MHz | I²C | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 254 x 8 | 1.8V ~ 5.5V | A/D 12x10b | Internal | |||||
| NXP USA Inc. MC9RS08KB2CSCR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | RS08 | Tape & Reel (TR) | Last Time Buy | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC9RS08 | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315339518 | EAR99 | 8542.31.0001 | 2,500 | 6 | RS08 | 8-Bit | 20MHz | I²C, SPI | LVD, POR, PWM, WDT | 2KB (2K x 8) | FLASH | - | 126 x 8 | 1.8V ~ 5.5V | A/D 4x10b | Internal | ||||
| NXP USA Inc. MC9S08AC128CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.31.0001 | 750 | 54 | S08 | 8-Bit | 40MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 128KB (128K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | |||||
| NXP USA Inc. MC9S08AC32CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 64-QFP | MC9S08 | 64-QFP (14x14) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935322866528 | 3A991A2 | 8542.31.0001 | 750 | 54 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 16x10b | Internal | ||||
| NXP USA Inc. MC9S08AC8CFGER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935319376528 | 3A991A2 | 8542.31.0001 | 1,500 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 8KB (8K x 8) | FLASH | - | 768 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S08AW16VFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 125°C (TA) | Surface Mount | 44-LQFP | MC9S08 | 44-LQFP (10x10) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935317017557 | 3A991A2 | 8542.31.0001 | 800 | 34 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S08AW32CFDER | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323088528 | 3A991A2 | 8542.31.0001 | 2,000 | 38 | S08 | 8-Bit | 40MHz | I²C, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | - | 2K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | ||||
| NXP USA Inc. MC9S08DZ32AMLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP | MC9S08 | 48-LQFP (7x7) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935324276528 | 3A991A2 | 8542.31.0001 | 2,000 | 39 | S08 | 8-Bit | 40MHz | CANbus, I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 16x12b | External | |||||
| NXP USA Inc. MC9S08LL16CGTR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | MC9S08 | 48-QFN-EP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935311239528 | EAR99 | 8542.31.0001 | 2,000 | 31 | S08 | 8-Bit | 20MHz | I²C, SCI, SPI | LCD, LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | ||||
| NXP USA Inc. MC9S08MP16VLFR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | MC9S08 | 48-LQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935310154528 | 3A991A2 | 8542.31.0001 | 2,000 | 40 | S08 | 8-Bit | 51.34MHz | I²C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 13x12b; D/A 3x5b | Internal | ||||
| NXP USA Inc. MC9S08PA16AVTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320568534 | EAR99 | 8542.31.0001 | 5,000 | 14 | S08 | 8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7V ~ 5.5V | A/D 12x12b | Internal | ||||
| NXP USA Inc. MC9S08PA4AVDC | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tray | Active | -40°C ~ 105°C (TA) | Surface Mount | 8-VDFN Exposed Pad | MC9S08 | 8-DFN (3x3) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 490 | 4 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | |||||
| NXP USA Inc. MC9S08PA4AVTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 5,000 | 14 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x12b | Internal | |||||
| NXP USA Inc. MC9S08PA4MTGR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | S08 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | MC9S08 | 16-TSSOP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.31.0001 | 2,500 | 14 | S08 | 8-Bit | 20MHz | LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 4KB (4K x 8) | FLASH | 128 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 8x12b | Internal |
