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| Compare | Image | Name | Manufacturer | Quantity | Weight(Kg) | Size(LxWxH) | Mfr | Series | Package | Product Status | Operating Temperature | Applications | Mounting Type | Package / Case | Base Product Number | Technology | Current - Supply | Voltage - Supply | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Function | Core Processor | Speed | Interface | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Security Features | Additional Interfaces | Output Configuration | Current - Output | Voltage - Load | Motor Type - Stepper | Motor Type - AC, DC | Step Resolution |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXP USA Inc. MCIMX6X3EVK10ABR | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6SX | Tape & Reel (TR) | Active | -20°C ~ 105°C (TJ) | Surface Mount | 400-LFBGA | MCIMX6 | 400-MAPBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935315799518 | 5A992C | 8542.31.0001 | 1,000 | ARM® Cortex®-A9, ARM® Cortex®-M4 | 227MHz, 1GHz | 2 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD, LVDS | 10/100/1000Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | AC'97, CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART | |||||||||||||||||
| NXP USA Inc. MCIMX6Y0DVM05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 289-LFBGA | MCIMX6 | 289-MAPBGA (14x14) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (1) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | I²C, SPI, UART | ||||||||||||||||||
| NXP USA Inc. MCIMX6Y1DVK05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (1) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||||||
| NXP USA Inc. MCIMX6Y7DVK05AA | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX6 | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 272-LFBGA | MCIMX6 | 272-MAPBGA (9x9) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 260 | ARM® Cortex®-A7 | 528MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, DDR3, DDR3L | No | Electrophoretic, LCD | 10/100Mbps (2) | - | USB 2.0 OTG + PHY (2) | 1.8V, 2.8V, 3.3V | A-HAB, ARM TZ, CSU, SJC, SNVS | CAN, I²C, SPI, UART | |||||||||||||||||
| NXP USA Inc. MCIMX7S3DVK08SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7S | Tray | Active | 0°C ~ 95°C (TJ) | Surface Mount | 488-TFBGA | MCIMX7 | 488-TFBGA (12x12) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935351918557 | 5A992C | 8542.31.0001 | 152 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | |||||||||||||||||
| NXP USA Inc. MCIMX7S5EVM08SD | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | i.MX7S | Tray | Active | -20°C ~ 105°C (TJ) | Surface Mount | 541-LFBGA | MCIMX7 | 541-MAPBGA (19x19) | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 84 | ARM® Cortex®-A7, ARM® Cortex®-M4 | 800MHz | 1 Core, 32-Bit | Multimedia; NEON™ MPE | LPDDR2, LPDDR3, DDR3, DDR3L | No | Keypad, LCD, MIPI | 10/100/1000Mbps (1) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | 1.8V, 3.3V | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | AC'97, CAN, eCSPI, I²C, I²S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART | ||||||||||||||||||
 |
NXP USA Inc. MCW68332A | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | * | Tray | Not For New Designs | MCW68332 | ROHS3 Compliant | REACH Unaffected | 935319459025 | 0000.00.0000 | 13 | |||||||||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903D5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SOIC-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 42 | CAN, LIN | ||||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903DD3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333163574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903DP3EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333199574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||||||||
| NXP USA Inc. MCZ33903DP5EK | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | System Basis Chip | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | MCZ33903 | 5.5V ~ 28V | 32-SSOP-EP | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935333218574 | EAR99 | 8542.39.0001 | 42 | CAN, LIN | |||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3000A4EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | i.MX Processors | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3000 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320468528 | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3000A5EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | i.MX Processors | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3000 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3000A7EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | i.MX Processors | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3000 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312511528 | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3000A8EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | i.MX Processors | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3000 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320745557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3001A2EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Processor | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3001 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320741557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3001A2EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Processor | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3001 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320741528 | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3001A4EPR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | Processor | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3001 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312882528 | EAR99 | 8542.39.0001 | 4,000 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3001A5EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Processor | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3001 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318654557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF3001A6EP | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 85°C | Processor | Surface Mount | 48-VFQFN Exposed Pad | MC32PF3001 | - | 2.8V ~ 5.5V | 48-HVQFN (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312927557 | EAR99 | 8542.39.0001 | 260 | ||||||||||||||||||||||||||
| NXP USA Inc. MC32PF4210A0ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | 0°C ~ 85°C (TA) | Audio, Video | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC32PF4210 | - | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||
| NXP USA Inc. MC32PF4210A1ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | 0°C ~ 85°C (TA) | Audio, Video | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | MC32PF4210 | - | 2.8V ~ 4.5V | 56-QFN-EP (8x8) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | EAR99 | 8542.39.0001 | 260 | |||||||||||||||||||||||||||
| NXP USA Inc. MC33660BEF | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tube | Active | Automotive | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | MC33660 | 8V ~ 18V | 8-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935312711574 | EAR99 | 8542.39.0001 | 98 | Serial Link Bus Interface | |||||||||||||||||||||||||||
| NXP USA Inc. MC33664ATL1EGR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TA) | Isolated Communications Interface | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | MC33664 | 40mA | 4.5V ~ 5.5V | 16-SOIC | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323606518 | EAR99 | 8542.39.0001 | 2,500 | ||||||||||||||||||||||||||
|
NXP USA Inc. MC33926ES | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C | General Purpose | Surface Mount, Wettable Flank | 28-VQFN Exposed Pad | MC33926 | - | 5V ~ 28V | 28-HVQFN (6x6) | download | ROHS3 Compliant | REACH Unaffected | 935316483699 | EAR99 | 8542.39.0001 | 1,300 | Driver | - | Half Bridge | 5A | - | Bipolar | Brushed DC | - | ||||||||||||||||||
| NXP USA Inc. MC33FS4500CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33FS4500 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935320783528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||
| NXP USA Inc. MC33FS4502CAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935323815528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||
| NXP USA Inc. MC33FS4502LAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935318766528 | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||||||||||||||
| NXP USA Inc. MC33FS4502NAE | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tray | Active | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33FS4502 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935313141557 | EAR99 | 8542.39.0001 | 250 | ||||||||||||||||||||||||||
| NXP USA Inc. MC33FS4503NAER2 | NXP USA Inc. |
Min: 1 Mult: 1 |
/image/NXP USA Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 125°C | System Basis Chip | Surface Mount | 48-LQFP Exposed Pad | MC33FS4503 | - | 1V ~ 5V | 48-HLQFP (7x7) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 935316311528 | EAR99 | 8542.39.0001 | 2,000 |
